AVS 45th International Symposium
    Organic Electronic Materials Topical Conference Tuesday Sessions
       Session OE+AS+EM-TuM

Paper OE+AS+EM-TuM7
Vapor Deposition Polymerization of 4-fluorostyrene and Pentafluorostyrene

Tuesday, November 3, 1998, 10:20 am, Room 327

Session: Organic Thin Film Interfaces
Presenter: B. Bartlett, Naval Research Laboratory
Authors: B. Bartlett, Naval Research Laboratory
L.J. Buckley, Naval Research Laboratory
D.J. Godbey, Naval Research Laboratory
M.J. Schroeder, U.S. Naval Academy
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Solventless deposition of thin, uniform dielectric films is of considerable interest and importance in the microelectronics industry, due to increasing wafer sizes and environmental concerns. This work demonstrates a solvent-free method for atmospheric pressure chemical vapor deposition polymerization of thin dielectric films on a variety of substrates, including Si, Mo, Pt, and Cu. The films are characterized using transmission FTIR, and XPS. Depth profiling is performed using XPS, elipsometry, and step profilometry. Film growth is found to be independent of substrate, and proceeds with an activation energy of 15 kcal/mol between 450K and 500K. Films are shown by GPC (gel permeation chromatography) to consist of low molecular weight polymer and oligimer species (between 3 and 165 repeat units). AFM analysis indicates that the RMS thickness variation along the surface is < 0.2%, verifying film uniformity.