Pacific Rim Symposium on Surfaces, Coatings and Interfaces (PacSurf 2018)
    Thin Films Wednesday Sessions
       Session TF-WeP

Paper TF-WeP12
The Effect of Cu Oxide Shell on the Flash Light Sintering of Cu Nanoparticle-ink on Si Wafer Substrate for Solar Cell Electrode

Wednesday, December 5, 2018, 4:00 pm, Room Naupaka Salon 1-3

Session: Thin Films Poster Session II
Presenter: Chung-hyeon Ryu, Hanyang University, Seoul, Korea
Authors: C.H. Ryu, Hanyang University, Seoul, Korea
J.H. Chu, Hanyang University, Seoul, Korea
A.P. Supriya, Hanyang University, Seoul, Korea
H.-S. Kim, Hanyang University, Seoul, Korea
Correspondent: Click to Email

In this study, flash light sintering method of Cu nanoparticle (NP)-ink on Si wafer substrate and the effect of Cu oxide shell type and thickness on flash light sintering process were investigated. The Cu NPs were oxidized in a heat chamber and the oxidation temperature was varied from 100 °C to 300 °C. The Cu NP-ink was fabricated using the oxidized Cu NPs and the fabricated Cu NP-ink with was printed on Si wafer substrate using screen printing method. To sinter the printed Cu NP-ink, multiple pulsed flash light irradiation was employed. The flash light irradiation conditions were optimized to obtain a high electrical conductivity of Cu NP-ink. In order to characterize the microstructures, scanning electron microscopy (SEM) was performed. X-ray diffraction (XRD) was conducted to investigate the oxidation or reduction of oxidized Cu NPs. The thickness of Cu oxide shell was measured using transmission electron microscopy (TEM). The sheet resistance and thickness of sintered Cu NP-ink was measured to calculate the resistivity of sintered Cu NP-ink.

Finally, the Cu NP-ink was successfully sintered on Si wafer substrate using multiple pulsed flash light and it had a 15.42 μΩ·cm resistivity.

Acknowledgments

This work was supported by a National Research Foundation of Korea (NRF), funded by the Ministry of Education (2015R1D1A1A09058418, 2012R1A6A1029029, and 2013M2A2A9043280). This work was also supported by the Industrial Strategic technology development program (10076562, Development of fiber reinforced thermoplastic nano-composite via fiber bundle spreading for high quality resin impregnation process and its application to the underbody shield component for protecting battery pack of an electric-vehicle) funded by the Ministry of Trade, industry & Energy (MI, Korea).