| Pacific Rim Symposium on Surfaces, Coatings and Interfaces (PacSurf 2016) | |
| Energy Harvesting & Storage | Wednesday Sessions |
| Session EH-WeP |
| Session: | Energy Harvesting & Storage Poster Session |
| Presenter: | Jinn P. Chu, National Taiwan University of Science and Technology, Taiwan, Republic of China |
| Authors: | W. Diyatmika, National Taiwan University of Science and Technology, Taiwan, Republic of China L. Xue, National Taiwan University of Science and Technology, Taiwan, Republic of China C. Yu, National Taiwan University of Science and Technology, Taiwan, Republic of China C. Lee, National Taiwan University of Science and Technology, Taiwan, Republic of China J. Chu, National Taiwan University of Science and Technology, Taiwan, Republic of China |
| Correspondent: | Click to Email |
Thin film metallic glass (TFMG) with its amorphous nature is of great interest owing to its unique properties, including high strength, large elastic limits, excellent corrosion, and wear resistance. Grain boundaries are generally considered as atomic diffusion path. Therefore, TFMG, possessing grain boundary-free structure, is thought to efficiently mitigate atomic diffusion.
In this presentation, we will report two examples of TFMG as the diffusion barrier on (1) Sn whisker mitigation in the Cu-Sn couples as well as (2) copper indium gallium selenide (CIGS) solar cells on stainless steel (SS). We found that TFMG effectively blocks the Cu/Sn interaction and thus minimizes Sn whisker formation, even with the thickness as thin as 25 nm. In addition, with very thin thickness, the introduction of TFMG underlayer is expected to yield insignificant degrees of compressive stress, which is anticipated to occur when the samples are exposed to thermal cycling. Furthermore, the detrimental iron diffusion from SS into CIGS is found to be effectively hindered by the introduction of a 70-nm-thick TFMG barrier; the cell performance is thus improved. Compared with the 2.73% of CIGS on bare SS, a higher efficiency of 5.25% is obtained for the cell with the TFMG barrier. Thin thickness and amorphous nature of TFMG are considered beneficial to make TFMGs as a promising diffusion barrier for Sn whisker and Fe diffusion mitigation in microelectronic packaging and flexible CIGS Solar Cell, respectively.