| Course | Year Offered | |||||||||||||||||
| 84 | 85 | 86 | 87 | 88 | 89 | 90 | 91 | 92 | 93 | 94 | 95 | 96 | 97 | 98 | 99 | 00 | 01 | |
| An Introduction to Ellipsometry | X | |||||||||||||||||
| An Overview of Thin Film Deposition & Etching Processes | X | X | X | X | ||||||||||||||
| Application of Residual Gas Analysis in Semiconductor Processes | X | |||||||||||||||||
| Basic Microelectronic Processing | X | X | ||||||||||||||||
| Basic Vacuum Technology | X | X | X | X | X | X | X | X | X | X | X | X | X | |||||
| Clean Room Technology | X | |||||||||||||||||
| CMP for Microelectronics Manufacturing | X | X | X | |||||||||||||||
| CVD For Microelectronics | X | X | X | X | X | |||||||||||||
| Depth Profiling | X | |||||||||||||||||
| Dielectrics for Microelectronics | X | X | X | |||||||||||||||
| Full Wafer Particle and Defect Detection, Review, Characterization | X | X | ||||||||||||||||
| Fundamentals and Process Characterization of Ion Implantation | X | |||||||||||||||||
| High Density Plasma Processing of Microelectronic Materials | X | X | ||||||||||||||||
| Mass Flow Controllers-Fundamentals, Techniques and Applications | X | X | X | |||||||||||||||
| Nucleation, Growth and Microstructure Evolution | X | X | ||||||||||||||||
| Operation & Maintenance of Vacuum Pumping Systems | X | |||||||||||||||||
| Optical Diagnostic Techniques for Plasma Processing | X | |||||||||||||||||
| Partial Pressure Analyzers, Analysis and Applications | X | |||||||||||||||||
| Plasma Enhanced CVD: Fundamentals, Techniques and Applications | X | X | X | |||||||||||||||
| Plasma Etching and RIE | X | X | X | X | X | X | X | X | ||||||||||
| Practical Process Design for Microlithography | X | |||||||||||||||||
| Pumping Hazardous Gases | X | X | X | X | ||||||||||||||
| Rapid Thermal Processing: Equipment Technology and Process | X | X | ||||||||||||||||
| Reactive Sputtering and Deposition | X | |||||||||||||||||
| Semiconductor Contacts-Their Science, Fabrication & Characterization | X | |||||||||||||||||
| Sputter Deposition | X | X | X | X | X | X | ||||||||||||
| Surface Analysis: The Major Methods | X | |||||||||||||||||
| Surface Analysis: The Major Methods | X | |||||||||||||||||
| Surface Preparation for Thin Film Deposition | X | X | ||||||||||||||||
| Understanding and Modeling Contamination in Vacuum | X | |||||||||||||||||
| Vacuum Leak Detection | X | |||||||||||||||||