AVS 64th International Symposium & Exhibition
    MEMS and NEMS Group Tuesday Sessions
       Session MN-TuP

Paper MN-TuP5
Effect of Seeding Material on Sc0.125Al0.875N c-axis Orientation

Tuesday, October 31, 2017, 6:30 pm, Room Central Hall

Session: MEMS/NEMS Poster Session
Presenter: Erica Douglas, Sandia National Laboratories
Authors: E.A. Douglas, Sandia National Laboratories
M.D. Henry, Sandia National Laboratories
T.R. Young, Sandia National Laboratories
B. Griffin, Sandia National Laboratories
Correspondent: Click to Email

While piezoelectric AlN is presently implemented into several commercial applications for electronic devices (such as bulk acoustic wave (BAW) and surface acoustic wave (SAW) filters), alloying AlN with Sc is actively being investigated as a method for increasing the piezoelectric coefficient d33. ScXAl1-XN, with x approaching 40%, has reported an increase in the piezoelectric coefficient of almost 4X, with potential for high impact for wireless applications by improving bandwidth and decreasing insertion loss. However, the addition of Sc into AlN has led to secondary grain growth, observed even for low Sc content thin films.

This work will demonstrate enhanced c-axis orientation of polycrystalline Sc0.125Al0.875N on <100> silicon by reactive sputtering with various seeding material, including Si, Pt, and AlCu. We will characterize (100) secondary grain growth on Si as a function of film thickness, as well as X-ray diffraction rocking curve full width half maximum (FWHM) of the (002) orientation. As film thickness increases, rocking curve FWHM approach 1.3 degrees for a 2.1 um film; low FWHM values are known to have high piezoelectric coupling. In addition, c-axis orientation was investigated with metal seeding material such as Pt and AlCu. 750nm Sc0.125Al0.875N exhibited a 20% reduction of (002) FWHM and complete suppression of (100) secondary grain growth when seeding on AlCu as compared to Si.

To quantify the effect of Sc0.125Al0.875N growth, contour mode width extensional resonators (CMRs) were fabricated and tested to extract fundamental device parameters such as quality factor(Q) and effective piezoelectric coupling coefficient (Keff2). The method for suppression of (100) secondary grain growth and improved (002) FWHM utilizing AlCu is CMOS compatible and is shown to create CMRs with -4 dB insertion losses and Keff2values of 2.3%.

This project was supported by the LDRD program at Sandia National Laboratories. Sandia National Laboratories is a multi-mission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC., a wholly owned subsidiary of Honeywell International, Inc., for the U.S. Department of Energy's National Nuclear Security Administration under contract DE-NA-0003525. The authors acknowledge and thank the staff of Sandia’s MESA fabrication facility.