AVS 64th International Symposium & Exhibition
    MEMS and NEMS Group Monday Sessions
       Session MN+BI+NS-MoM

Invited Paper MN+BI+NS-MoM1
Large Scale Integration: A Not-so-simple Cure for Loneliness of Silicon Nanoresonators

Monday, October 30, 2017, 8:20 am, Room 24

Session: Feature Session: Large Scale Integration of Nanosensors
Presenter: Sébastien Hentz, Cea Leti, France
Correspondent: Click to Email

After two decades of pioneering work, Nano Electro Mechanical Systems are only starting to fulfil (some) of their huge promises, in particular for sensing. A few start-up companies have been created in the last few years, but NEMS are still far from the industrial success of their micro- counterparts. Among others, one reason is the increasing difficulty to interface the "real-world" quantities to sense with the extremely small size of nanomechanical resonators. An easy to understand example of this is mass sensing: there is huge size mismatch between the NEMS capture cross section (in the µm2 range) and an actual particle beam size that one can produce (in the mm to 10mm2 range). Most of the particles to detect are lost. Industrial applications may require the use of large arrays comprising from 10's to 10000's NEMS.

LETI has been working on nanomechanical resonators for a number of applications in the last ten years and have been pioneering their fabrication with Very Large Scale Integration processes. State of the art performance (signal to background ratio, signal to noise ratio, frequency stability...) has been reached with single silicon resonators and specific transduction means adapted to VLSI technologies. The real strength of VLSI though, as evidenced every day by microprocessor fabrication is the possibility to process a large number of devices operating in sync with great reproducibility and control.

We investigated several types of NEMS arrays in the past at LETI. Arrays comprising typically a few 1000 resonators all connected in parallel for gas sensing have been demonstrated. Smaller arrays with the ability to weigh and localize single particles via frequency addressing have been tested too for mass spectrometry applications. LETI has also been pioneering NEMS co-integration with CMOS in the last decade or so and several technologies have been explored. We took advantage of this know-how to fabricate large and dense arrays of NEMS-CMOS arrays for mass sensing applications.