| AVS 62nd International Symposium & Exhibition | |
| Thin Film | Thursday Sessions |
| Session TF-ThP |
| Session: | Thin Films Poster Session |
| Presenter: | Jason Hrebik, Kurt J. Lesker Company |
| Correspondent: | Click to Email |
The thin film coating industry, particularly in magnetron sputtering, is a critical means for our current and future advancements in technology. There are a wide range of applications, which have many critical performance requirements to make them successful. The main component driving these applications is the magnetron sputtering cathode or "magnetron".
In many cases, it is difficult to find an ideal "magnetron" that can meet all of the process requirements. In addition, there are a broad range of "magnetron" providers in the industry that all have advantages and disadvantages to their technology. This can make choosing the best option very difficult.
One of the most critical performance requirements in any magnetron design is target cooling. Good thermal conductivity between the target and the cathode is essential for maximum power density and sputtering rate. The new Mag Keeper sputtering source utilizes an enhanced target cooling design in which the cooling water flows through a brazed copper channel that is in direct contact with the backside of the sputtering target. This along with a magnetically enhanced clamping force provides an uncompromised cooling advantage.
In addition, the Mag Keeper design has only a single metal seal, contains no O-rings, and utilizes all ceramic insulators, making it both HV and UHV compatible.
Over the course of extensive performance testing campaign, the design showed several key advantages. Using a variety of target materials, it was found that the Mag Keeper's cooling efficiency is comparable to that of a direct-cooled magnetron providing the ability to run at power densities over 200 watts/ in2 with thermally conductive materials such as copper and aluminum. A key advantage to the magnetic profile was the ability to operate a 0.375" thick non-magnetic target at 0.5mTorr pressure. In terms of target erosion, the Mag Keeper design has a very broad profile maximizing both utilization and uniformity. In addition, with the High Strength magnet configuration, a 3" source was able to sputter up to 3mm thick Fe.
From a mechanical standpoint, the Mag Keeper source does not use a target clamp or anode shield assembly resulting in a very quick target change averaging less than 5 minutes due to only having to loosen (2) bolts in order to access the target.
In conclusion, the Mag Keeper magnetron design offers the industry a design that is capable of meeting a very broad range of application requirements with the conveniences needed for meeting production efficiencies!