AVS 62nd International Symposium & Exhibition
    Advanced Surface Engineering Tuesday Sessions
       Session SE-TuP

Paper SE-TuP2
Biocompatibility of Porous TaOxNy Films with Various O/N Ratio

Tuesday, October 20, 2015, 6:30 pm, Room Hall 3

Session: Advanced Surface Engineering Poster Session
Presenter: YiChih Lin, Ming Chi University of Technology, Taiwan, Republic of China
Authors: J.H. Hsieh, Ming Chi University of Technology, Taiwan, Republic of China
Y.C. Lin, Ming Chi University of Technology, Taiwan, Republic of China
S.J. Liao, Ming Chi University of Technology, Taiwan, Republic of China
C. Li, National Yang Ming University, Taiwan, Republic of China
Y.H. Lai, Ming Chi University of Technology, Taiwan, Republic of China
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The oxynitride of a transition metal is able to form a new grade of functional thin film. Controlling oxygen-to-nitrogen ratio allows one to tune the film properties. The tunable properties include optical and mechanical properties, and biocompatibility, etc. In this study, TaOxNy-Cu films were first prepared using reactive co-sputtering, with the variation of O/N flow ratios. After deposition, the films were annealed, and Cu was etched away to form porous oxynitride structures with various O/N ratio. The films were characterized using nano-indentation, XRD, and SEM. The results showed that the porosity of these films could be varied depending on Cu contents and O/N ratios. The samples were then tested for their biocompatibility and viability using 3-T-3 fibroblast cells. According to the results obtained from biocompatibility and MTT assay testing, it was found that the O/N ratio should be near the transition of semiconductor to conductor. Furthermore, the pore size played a major role in terms of biocompatibility and cell viability. An optimal pore size was found around 200 um.