AVS 62nd International Symposium & Exhibition
    Exhibitor Technology Spotlight Wednesday Sessions
       Session EW-WeL

Paper EW-WeL6
Variations on Vacuum Baking for MEMS Processing

Wednesday, October 21, 2015, 2:00 pm, Room Hall 1

Session: Exhibitor Technology Spotlight Session
Presenter: William Moffatt, Yield Engineering Systems, Inc.
Authors: W. Moffatt, Yield Engineering Systems, Inc.
K. Sautter, Yield Engineering Systems, Inc.
Correspondent: Click to Email
Yeld Engineering Systems’ latest series of ovens are essential tools for Semiconductor, MEMS and Wafer-level packaging (WLP) processes. The full presentation will explain the technical process involved for each tool in the YES-VertaSeries: The YES-VertaCure automated, high temperature cure series of ovens helps achieve total environmental control to increase yields and extend device performance.

Applications

 Polyimide cure

 BCB cure

 Low temp polymers cure

 Copper anneal

The YES-VertaCoat automated, silane vapor deposition system is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s precise surface modification to reduce stiction for MEMS devices or a thin copper diffusion barrier layer in an advanced semiconductor device, the capability to use a large number of different organosilanes provides the ability for precise surface modification.

Applications

 Wafer dehydration

 Surface tension modification

 Copper diffusion barrier

The YES-VertaVac series of automated high vacuum ovens ensures moisture and hydrogen removal using high vacuum (10-5) and high temperature (up to 450°C). Our patented nitrogen purge precedes process ramp and creates a successful procedure for improved MEMS lifetime and performance.

Applications:

 Wafer dehydration

 Getter activation

 Metal annealing