AVS 62nd International Symposium & Exhibition | |
Additive Manufacturing/3D Printing Focus Topic | Thursday Sessions |
Session AM+EM+MS+TF-ThA |
Session: | Additive Fabrication for Electronic Devices and Systems |
Presenter: | Ana Claudia Arias, University of California at Berkeley |
Authors: | A.C. Pierre, University of California at Berkeley A.C. Arias, University of California at Berkeley |
Correspondent: | Click to Email |
The area of printed electronics has been focused on the use of new classes of semiconducting and conducting materials in two main applications, displays and photovoltaics. Both applications require materials long-term stability, long shelf life as well the need for patterning and deposition over large areas. Over the past 10 years significant progress in the performance of printable materials has been reported including highly efficient solar cells, light emitting diodes and thin film transistors with mobilities as high as 10 cm2/Vs. The work is highly motivated by the potential for high through put, high volume, low cost manufacturing. While large area electronics continues to be a good application for printed flexible devices, wearable medical devices, which benefit from new form factors, represent a good shift in direction of research in the field. Wearable medical sensors have the potential to play an essential role in the reduction of health care costs as they encourage healthy living by providing individuals feedback on personal vital signs and enable the facile implementation of both in-hospital and in-home professional health monitoring. In printed flexible electronics however, there are no standards for materials set, device models and fabrication methods. This lack of standards slows down design of new systems and the success of the technology as a whole. In this talk, I will review the state of the art of devices produced by printing and introduce a blade coating method that yields highly homogeneous flexible thin films that are applied to LEDS, photodiodes and TFTs. The application of these devices as building blocks for flexible electronics systems will also be discussed.