AVS 61st International Symposium & Exhibition
    Thin Film Tuesday Sessions
       Session TF+AS+EM-TuA

Paper TF+AS+EM-TuA7
Kinetically-Limited Lattice Relaxation in Linearly- and Non-Linearly- Compositionally-Graded InxGa1-xAs/GaAs (001) Metamorphic Heterostructures

Tuesday, November 11, 2014, 4:20 pm, Room 305

Session: Thin Film: Growth and Characterization II
Presenter: Tedi Kujofsa, University of Connecticut
Authors: T. Kujofsa, University of Connecticut
J.E. Ayers, University of Connecticut
Correspondent: Click to Email

Metamorphic buffer layers allow tremendous flexibility to design novel InGaAs/GaAs semiconductor heterostructures for application in various microelectronic and optical devices. However, device fabrication, reliability and performance are limited by dislocation defects associated with the growth of highly mismatched systems such as InGaAs on GaAs substrate. Thus, understanding kinetically-limited lattice relaxation and development of a plastic flow model applicable to multilayered and compositionally graded heterostructure is desirable to provide guidance in designing InGaAs/GaAs devices. Previously, we reported a plastic flow model for ZnSySe1-y/GaAs (001) heterostructures which predicts the non-equilibrium strain relaxation as well as misfit dislocation and threading dislocation densities. Here, we have extended our model to InxGa1-xAs/GaAs (001) metamorphic buffer layers with arbitrary compositional grading profile. In addition, we have investigated the evolution of the kinetically limited in-plane strain of InxGa1-xAs/GaAs (001) heterostructures with an emphasis on grading schemes employing a step, linear-, S- and power-law- lattice mismatch compositional profile. For each structure, we have studied the thickness and grading coefficient dependence on the average and surface kinetically-limited in-plane strain. In addition, we show that the use of compositionally graded buffer layers enables the design of InxGa1-xAs/GaAs (001) heterostructures with high surface strain values which enhance the sweeping of threading defects and therefore yielding device structures with minimal defect.