AVS 61st International Symposium & Exhibition
    Exhibitor Technology Spotlight Wednesday Sessions
       Session EW-WeL

Paper EW-WeL3
Safe and Efficient - Dry Bed Exhaust Gas Abatement of Toxic Gases I

Wednesday, November 12, 2014, 1:00 pm, Room Hall ABC

Session: Exhibitor Technology Spotlight Session
Presenter: Sam Yee, CS Clean Systems Inc.
Correspondent: Click to Email

The NOVAPURE ® series offers a safe, efficient and reliable solution for treatment of hazardous process gases and by-products.

This unique system uses chemisorptive granulate technology to treat process gases in a negative pressure environment ensuring only inbound flows. Continuous gas monitoring assures total point-of-use gas treatment below TLV levels. In the event of a power outage, the NOVAPURE system will continue to treat the inflows.

The built-in 90% depletion feature provides warning of breakthrough when the granulate is 90% consumed. The remaining capacity allows the current process to run-to-finish and time to schedule a shutdown for canister replacement.

Chemisorptive technology provides irreversible reactions with process gases and their byproducts, forming non-volatile solids. The spent canister can be easily and safely disposed of or incinerated. Air pollution regulations, employee health concerns, and growing awareness of toxic agents from semiconductor processes demand increased improvements in exhaust gas conditioning.

The NOVAPURE® Dry Scrubber reduces the hazards associated with flammable, toxic or corrosive gases and vapors.

NOVAPURE® effluent gas scrubbers offer an extremely safe and efficient way to treat toxic and corrosive gases resulting from hazard processes. This scrubber is a technologically advanced dry chemical scrubber containing approximately 32 or 37 gallons of scrubbing media. The scrubber is suitable for use in production and general laboratory environments. Operating passively at ambient temperature, chemical resins in the canister react on contact with process gases and by-products, converting them to non-volatile inorganic solids.

Applications include: Ion Implant, Etch, ALD, CVD, III-V, and MOCVD. Flow limit is 240slpm. The unit is equipped with built in bypass, end point detector.