AVS 61st International Symposium & Exhibition
    Electronic Materials and Processing Tuesday Sessions
       Session EM-TuP

Paper EM-TuP26
TiN/Ag Multilayers made by dc Magnetron Sputtering for Patch Antennas Applications

Tuesday, November 11, 2014, 6:30 pm, Room Hall D

Session: Electronic Materials and Processing Poster Session
Presenter: José Ampuero, Universidad Nacional de Ingeniería, Peru
Authors: J.L. Ampuero, Universidad Nacional de Ingeniería, Peru
A.F. Talledo, Universidad Nacional de Ingeniería, Peru
V. Peña, Universidad Nacional de Ingeniería, Peru
C. Benndorf, Universidad Nacional de Ingeniería, Peru
M. Yarlequé, Pontificia Universidad Católica del Peru
R. Cerna, Pontificia Universidad Católica del Peru
Correspondent: Click to Email

Titanium nitride has excellent physical properties such us high hardness, high abrasion wear resistance, as well as, high corrosion resistance, however, its electrical conductivity is poor compared to that of noble metals such as cooper, silver or gold. On the other hand, silver films show excellent conductivity but in contact with normal atmosphere they are spoiled rapidly.

We have found that multilayers of silver and titanium nitride show high conductivity, high hardness and high corrosion resistance which make them useful for electrical and electronic applications.

In this paper we report (i) the production of silver-titanium nitride multilayers made by dc magnetron sputtering, (ii) structural and stoichiometry characterization made by X-ray diffraction and Auger electron spectroscopy. We also report the performance of patch antennas made of TiN/Ag multilayers deposited by dc magnetron sputtering on alumina plates. The analysis was made by using a Vector Network Analyzer. Typical bandwidth was in the range 3.3-3.4 GHz.