AVS 61st International Symposium & Exhibition
    2D Materials Focus Topic Thursday Sessions
       Session 2D+AS+HI+NS+SS-ThM

Paper 2D+AS+HI+NS+SS-ThM5
Graphene Transfer onto sub 1nm Al2O3/TiOPc/Graphene Gate Stacks

Thursday, November 13, 2014, 9:20 am, Room 310

Session: Nanostructures including 2D Heterostructures, Patterning of 2D Materials 
Presenter: Iljo Kwak, University of California at San Diego
Authors: I.J. Kwak, University of California at San Diego
J.H. Park, University of California at San Diego
H.C.P. Movva, University of Texas at Austin
E.K. Kinder, University of Notre Dame
H.L. Lu, University of Notre Dame
A.C. Kummel, University of California at San Diego
Correspondent: Click to Email

A novel transfer method with chemically controlled interfacial adhesion is reported for the fabrication of novel logic devices. This method allows direct transfer onto gate stacks and eliminates the possibility of Au electrodes deposition could shorting the thin oxide prior to transfer. The top graphene layer was grown on a Cu layer on a SiO2/Si substrate by CVD. Au electrodes were deposited on top of the graphene by e-beam evaporation. To transfer the graphene layer, PIB (Polyisobutylene) were drop cast on top of graphene prior to bonding of the Au/graphene/Cu to a PDMS (Poly-dimethylsiloxane) film. The PIB serves to moderate the adhesion between the PDMS (Poly-dimethylsiloxane) and the Au electrodes. The PDMS provides mechanical support. Afterwards, the PDMS/PIB/Au/graphene/Cu/SiO2/Si stack was immersed in ammonium persulfate solution to dissolve the Cu, releasing the top graphene stack. The bottom gate stack was HOPG (highly ordered pyrolytic graphite) with a sub-nano Al2O3 film on a monolayer TiOPc(titanyl phthalocynine) film. The monolayer TiOPc was deposited via MBE at 100C and annealed to 250C to insure a monolayer film. The TiOPc acts as a nucleation layer for the oxide ALD. The Al2O3 layer was deposited by ALD using TMA (Trimethylaluminum) and H2O at 100 C. The PDMS/PIB/Au/Graphene stack was placed on the gate stack, and PDMS was removed. Using hexane solution, the rePIB layer was dissolved, leaving clean graphene surface. To measure the oxide characteristics, an AFM was converted into a capacitance meter. This measurement allows non-destructive probing of Au/graphene/Al2O3/TiOPc/graphene structure while conventional probe station could damage the oxide or electrodes.