AVS 60th International Symposium and Exhibition | |
Synchrotron Analysis Focus Topic | Wednesday Sessions |
Session SA+AS+MI+SS-WeM |
Session: | Synchrotron and Imagery: PEEM, Nano-ARPES and Others (8:00-9:40 am)/Synchrotron TXRF and Related Techniques (10:40 am-12:00 pm) |
Presenter: | F. Meirer, Utrecht University, Netherlands |
Correspondent: | Click to Email |
Grazing incidence (GI) and grazing exit (GE) geometries exhibit exotic geometries in x-ray fluorescence (XRF) spectroscopy and are mainly used to restrict the information depth of the analysis to the sample surface. For samples with sufficiently small surface roughness, variation of the angle of incidence within the range of the critical angle of total (external) reflection of x-rays allows obtaining information about the depth distribution of elements within the sample’s surface. In total reflection x-ray fluorescence analysis (TXRF) the effect of total reflection is utilized adjusting the measurement angle below the critical angle. TXRF offers excellent detection limits and is routinely used for chemical trace analysis and surface contamination control.
The use of synchrotron radiation (SR) is highly beneficial for TXRF and for angle-dependent XRF in general, because its properties (e.g., high intensity, linear polarization, small source size, and natural collimation) make it ideally matched to the requirements of these techniques. Furthermore, when using SR as x-ray source these methods can be combined with x-ray absorption spectroscopy (XAS) analyzing the local coordinate structure of an element of interest in the sample. This extends XAS to the trace element level (ppb) in samples where only small amounts are available or where the sample is confined in or on the surface of a substrate material.
In this presentation I will review strengths and weaknesses of SR induced TXRF, GI-XRF and GE-XRF and their combination with XAS on the basis of the analysis of state-of-the-art ultra shallow arsenic implants in silicon produced by plasma immersion ion implantation and deposition (PIIID) and subsequent LASER annealing.