Paper TF2+EM-WeA3
Dynamics of Solid Thin-Film Dewetting in the Silicon-On-Insulator System
Wednesday, November 2, 2011, 2:40 pm, Room 110
Session: |
Nanostructuring Thin Films |
Presenter: |
Ezra Bussmann, CINaM-CNRS, France |
Authors: |
E. Bussmann, CINaM-CNRS, France F. Cheynis, CINaM-CNRS, France F. Leroy, CINaM-CNRS, France P. Müller, CINaM-CNRS, France |
Correspondent: |
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Thin-film dewetting is a process wherein a film on a substrate spontaneously agglomerates into 3D islands, which in some instances are ordered. A detailed understanding of the mechanism and dynamics of dewetting is crucial, either to avoid the agglomeration, or to engineer organized arrays of nanostructures. Silicon-on-Insulator (SOI) films, which are promising substrates for microelectronics, undergo dewetting when annealed at >700°C under ultrahigh vacuum conditions. The Si film spontaneously transforms into an assembly of ordered nano-sized Si islands. Previous ex-situ studies of dewetted SOI films provided a qualitative description of the dewetting process [1-4]. However, the dewetting dynamics, as well as the thermodynamic driving forces and atomistic mechanisms at work, remained largely unclear. We simultaneously measure the real-time dewetting dynamics and the motion of surface atomic-steps (surface self-diffusion) using low-energy electron microscopy (LEEM) [5]. We observe the following scenario: (i) dewetting voids nucleate at defects in the Si(001) layer. In the early stages of dewetting, the area of the opening voids grows linearly with time, and the Si ejected from the voids accrues into a rim surrounding the dewetted area. (ii) As dewetting progresses, the rim undergoes an instability that leads to the formation of elongated Si fingers. Once the first fingers have formed, the void area grows as the square of time. (iii) Finally, the Si fingers undergo a Plateau-Rayleigh instability, breaking apart into 3D Si nano-islands. We compare our measurements of the morphological evolution of dewetting to a simple analytical model for dewetting void growth (based on surface diffusion, nucleation on the top of the 3D structures, and mass-conservation), and to Kinetic Monte Carlo simulations. The KMC simulations reproduce the qualitative features of the complex void shape evolution in detail, while the analytical model of void growth allows us to connect the void growth rate with the dewetting driving force. These approaches unambiguously show that the SOI dewetting process is surface-diffusion-limited and driven by surface and interface free-energy-minimization.
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[4] E. Dornel et al., Phys. Rev. B 73, 115427 (2006).
[5] E. Bussmann et al., New J. Phys. 13 043017 (2011).