AVS 58th Annual International Symposium and Exhibition | |
Thin Film Division | Wednesday Sessions |
Session TF2+EM-WeA |
Session: | Nanostructuring Thin Films |
Presenter: | Deborah Paskiewicz, University of Wisconsin Madison |
Authors: | D.M. Paskiewicz, University of Wisconsin Madison B. Tanto, University of Wisconsin Madison D.E. Savage, University of Wisconsin Madison M.G. Lagally, University of Wisconsin Madison |
Correspondent: | Click to Email |
Silicon-Germanium semiconductor alloys are important in improving Group IV opto- and microelectronics. Typically, SiGe is used as a stressor to introduce strain into Si, thereby altering the electronic band structure [1, 2] or changing optical properties [3]. The SiGe stressor can be incorporated locally to strain small areas of Si uniaxially [2], or relaxed SiGe can be used as a substrate for growth of biaxially strained Si over large areas [1]. We will focus on the latter: using relaxed SiGe to induce global biaxial strain in Si. Conventional methods for creating relaxed SiGe substrates involve epitaxial growth on Si substrates and relaxation of the alloy via dislocations. The density of defects that reach the top relaxed SiGe layer can be limited though various techniques [4], but strain inhomogeneities and surface roughness created by the dislocations remain. We demonstrate the fabrication of SiGe nanomembranes (NM): fully elastically relaxed, smooth, single-crystalline sheets of SiGe alloy. A thin SiGe layer (less than the kinetic critical thickness for dislocation formation) is grown on a silicon-on-insulator (SOI) substrate with molecular beam epitaxy (MBE), followed by a Si capping layer of similar thickness to the Si template layer of the SOI. The SiO2 layer of the SOI is selectively etched away, leaving the Si/SiGe/Si trilayer heterostructure free to strain share [5]. The Si layers of the trilayer are then selectively etched away, leaving a fully elastically relaxed SiGe NM. These SiGe NMs can be transferred to new handling substrates, bonded, and used as templates for growth of new defect-free materials.
A specific application involving strained Si/relaxed SiGe heterostructures is fabrication of 2-dimensional electron gas devices (2DEGs) that can be patterned and gated to confine individual electrons into quantum qubits with long spin coherence times [6]. These devices are very sensitive to changes in the electrostatic potential and thus require superb material quality. We compare the material quality of strained Si/SiGe heterostructures grown on SiGe NMs with those created on SiGe substrates relaxed via dislocations.
Research supported by DOE. Facilities support from NSF-MRSEC is acknowledged. DMP is supported by a NSF Graduate Research Fellowship.
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