AVS 58th Annual International Symposium and Exhibition
    Advanced Surface Engineering Division Thursday Sessions
       Session SE-ThM

Paper SE-ThM4
Structure and Properties of TaN-(Ag,Cu) Nanocomposite Thin Films

Thursday, November 3, 2011, 9:00 am, Room 104

Session: Nanostructured Thin Films and Coatings
Presenter: Jang Hsing Hsieh, Ming Chi University of Technology, Taiwan, Republic of China
Authors: J.H. Hsieh, Ming Chi University of Technology, Taiwan, Republic of China
S.Y. Hung, Ming Chi University of Technology, Taiwan, Republic of China
S.Y. Chang, National Chung Hsing University, Taiwan, Republic of China
C. Li, National Central University, Taiwan, Republic of China
Correspondent: Click to Email
TaN-(Ag,Cu) nanocomposite thin films with various Ag/Ti ratios were deposited by reactive co-sputtering on Si(001) substrates. The samples were then annealed using RTP(Rapid Thermal Processing) at 400 C to induce the nucleation and growth of Ag/Cu nano-particles in TaN matrix and on film surface. One set of TaN-(Ag60,Cu40) were annealed at various temperatures. The structure and morphologies were examined using XRD, FESEM, and HRTEM. Nano-indenter was used to study the variation of mechanical properties. The results reveal that the mechanical properties were affected by the annealing temperature rather than the atomic ratios of Ag/Cu. However, the anti-bacterial behaviors against E. coli and S. aureus were significantly affected by the Ag/Cu ratios.