| AVS 58th Annual International Symposium and Exhibition | |
| Plasma Science and Technology Division | Thursday Sessions |
| Session PS-ThP |
| Session: | Plasma Science and Technology Poster Session |
| Presenter: | Vladimir Nagorny, Mattson Technology, Inc. |
| Authors: | V. Nagorny, Mattson Technology, Inc. D. Lee, Mattson Technology, Inc. |
| Correspondent: | Click to Email |
RF plasma sources used in modern plasma etch applications are required to provide a high plasma uniformity and variety of plasma controls, including independent plasma profile, plasma density and ion energy controls. They must be able to sustain a stable plasma in a very different gases and under very different conditions (gas flow, gas pressure, etc.). Finally, going forward the system has to produce a minimum impact on environment (energy consumption, EM emission). Mattson Technology has developed an etch tool with a new and efficient ICP source that uses two coils operating at significantly different frequencies (13.56 and 2 MHz) by utilizing a ferromagnetic core in a low frequency coil. Tests on the tool revealed that
· It provides high-density plasma generation, with no capacitive coupling between plasma and the source;
· There is no interference between higher and lower frequency RF subsystems;
· It provides good plasma and process profile control;
· It has wide processing window (gas pressure, gas flow, gas composition, source and bias power);
· High efficiency and stability of operation with both electropositive and electronegative gases.