Paper GR+MN-WeM10
Inhomogeneous Strain in Monolayer Epitaxial Graphene
Wednesday, November 2, 2011, 11:00 am, Room 208
Session: |
Graphene: Mechanical and Thermal Properties, Graphene MEMS and NEMS |
Presenter: |
Diedrich Schmidt, Ruhr-University Bochum, Germany |
Authors: |
D.A. Schmidt, Ruhr-University Bochum, Germany T. Ohta, Sandia National Laboratories L.B. Biedermann, Sandia National Laboratories T.E. Beechem, Sandia National Laboratories S.W. Howell, Sandia National Laboratories G.L. Kellogg, Sandia National Laboratories |
Correspondent: |
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We report a large in-plane compressive strain (up to 0.5%) and its inhomogeneous variation at micrometer length scale in single layer graphene films on silicon-carbide (SiC) (0001). The strain, due to the difference in lattice constants and thermal expansion coefficients of graphene and SiC substrate, is probed using Raman scattering. We show that both the growth mechanism and the relaxation along the mismatched symmetry of the graphene and underlying substrate can affect the exact amount of local strain. The large compressive strain implies that monolayer graphene is tightly grafted to the underlying interface layer and SiC substrate; otherwise it would delaminate to relieve the strain. The magnitudes of the structural strain and its local variation are significant and need to be taken into account for electronics applications based on the graphene-SiC(0001) system.
The Raman microscope was supported under BMBF grants 05KS7PC2. D. A. S acknowledges support within the BMBF funded projects 05KS7PC2 and 05K10PCA. The work was also supported in part by the LDRD program at SNL and the US DOE Office of Basic Energy Sciences’ Division of Materials Science and Engineering (Contract No. DE-AC04-94AL85000). Part of this work was performed at CINT (Contract No. DE-AC04-94AL85000). SNL is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-AC04-94AL85000.