AVS 58th Annual International Symposium and Exhibition
    Electron Transport in Low Dimensional Materials Focus Topic Monday Sessions
       Session ET+EM+SS-MoM

Invited Paper ET+EM+SS-MoM8
Grain Boundary Resistivity in Copper Nanowires

Monday, October 31, 2011, 10:40 am, Room 209

Session: Quantum Transport: From 0- to 2-Dimensions
Presenter: Tae-Hwan Kim, POSTECH, South Korea
Correspondent: Click to Email

The reliable choice of the interconnect materials in current integrated circuits is copper because of its higher electrical conductivity and improved stability against electromigration among all possible candidates. However, as the width of interconnects is approaching a mean free path of the electrons, the resistivity of copper interconnects is known to increase dramatically. Typically, this increase in the resistivity of the narrow interconnect is attributed to enhanced sequential scattering of electrons from defect planes such as either grain boundaries (GB) or other surfaces/interfaces. But, it is very challenging to distinguish which scattering factor is dominant over others in such a small scale.

To answer such a fundamental question, theorists developed semi-empirical methods and the relative contribution of various electron scattering mechanisms has been understood largely by relying on the semi-empirical methods based on the theories of Fuchs-Sondheimer and Mayadas-Shatzkes. The direct measurements of the resistance of individual GBs have been surprisingly lacking mainly due to technical difficulty to access single GBs in a nanowire that could not be realized by conventional fabrication methods using a fixed electrical contacts. Recently, Y. Kitaoka et al. have observed a resistance change along a damascene Cu interconnect wire with four-probe scanning microscope. They successfully separated the GB scattering effect from other scattering sources; however, the direct correlation between the GB structure and the specific GB resistivity remained unclear.

Here we present the direct measurement of individual GB resistances and the critical role of GB structure in the increased resistivity in copper nanowires with a four-probe scanning tunneling microscope. The resistances of high symmetry coincidence GBs are then calculated using a first-principle method, which confirms that the coincidence GBs have orders of magnitude smaller resistance than those measured at the high-angle random GBs. As well, to explain high resistivity of random GBs, we used free-electron-with-random-point-scatterer (FERPS) model. In the FERPS model, we derived that the specific GB resistivity of random GB is independent of the specific structures of random GB such as orientation and is determined entirely by the Fermi wavelength of the bulk.

This research was conducted at the Center for Nanophase Materials Sciences, which is sponsored at Oak Ridge National Laboratory by the Office of Basic Energy Sciences, U.S. Department of Energy.