AVS 58th Annual International Symposium and Exhibition
    Electronic Materials and Processing Division Thursday Sessions
       Session EM+TF-ThM

Paper EM+TF-ThM12
Electroless Deposition of Metals on SiO2 Surfaces Modified by a Self-Assembled Monolayer

Thursday, November 3, 2011, 11:40 am, Room 210

Session: Hybrid Electronic Materials and Interfaces
Presenter: Rahul Jain, University of Arizona
Authors: R. Jain, University of Arizona
A. Ng, University of Arizona
A.J. Muscat, University of Arizona
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Self-assembled monolayers (SAMs) are used to both chemically activate and deactivate semiconductor surfaces. For instance, octadecyltrichlorosilane prevents atomic layer deposition of high-k films, and 3-aminopropyltriethoxysilane promotes metal deposition. The formation of a uniform and defect free monolayer is essential for nano-scale device fabrication. SAMs could serve as an adhesion layer, which is required for the electroless deposition of metals on some dielectric surfaces. Electroless deposition processes in particular are known to be sensitive to the surface termination and are not robust. In this work, the thickness and density of an aminosilane SAM formed on a SiO2 surface were monitored as a function of solvent, concentration, and time, and the metal to N ratio was quantified.

A 3-aminopropyltrimethoxysilane (APTMS) SAM was formed on a well-hydroxylated SiO2 surface. SAM formation was studied as a function of solvent (methanol and toluene), APTMS concentration (5.72 mM and 57.2 mM), immersion time, solution agitation (stirring and sonication), and post-deposition rinsing in methanol or chloroform depending on the solvent used. The thickness of the APTMS SAM using ellipsometry was 7.8±0.2 Å after 15 min when prepared by stirring an APTMS-methanol solution. This thickness corresponds to the expected length of an APTMS molecule. The roughness was 0.3±0.1 nm measured over 2×2 µm2 regions using atomic force microscopy. These thickness and roughness values indicate that thin, uniform layers were formed using this method. The absence of a peak for methoxy groups in the high resolution C 1s x-ray photoelectron spectroscopy (XPS) spectrum suggests that all of the methoxy groups were hydrolyzed on the APTMS molecules that reacted with the surface. A single peak in the N 1s spectrum at 399.7 eV indicates the presence of a primary amine when the SAM was prepared in methanol. A second peak was also observed at 400.4 eV corresponding to a hydrogen-bonded amine when the SAM was prepared in toluene. These results suggest that all the SAM molecules were bonded to the surface by siloxane (Si-O-Si) linkages and that amine groups were directed away from the surface with the methanol solvent. Based on XPS peak areas, the molecular density in the SAM layer was 5.4±1.9 molecules/nm2. A layer of Pd atoms was successfully deposited by immersing the APTMS SAM surfaces in an 80 mM PdCl2-HCl solution for 2 min, yielding one Pd atom bonded to two amine groups based on XPS peak areas. These results demonstrate that an adhesion layer can be formed that will bind metal. Future work will be done to determine how strongly the metal layer adheres to the SAM.