AVS 57th International Symposium & Exhibition
    Advanced Surface Engineering Tuesday Sessions
       Session SE-TuP

Paper SE-TuP7
Effects of Ag/Cu Ratios on the Annealing Temperature and Mechanical Properties of TaN-(Ag,Cu) Nanocomposite Thin Films

Tuesday, October 19, 2010, 6:00 pm, Room Southwest Exhibit Hall

Session: Advanced Surface Engineering Poster Session
Presenter: J.H. Hsieh, Ming Chi University of Technology, Taiwan, Republic of China
Authors: J.H. Hsieh, Ming Chi University of Technology, Taiwan, Republic of China
S.Y. Hung, Ming Chi University of Technology, Taiwan, Republic of China
S.Y. Chang, National Chung Hsing University, Taiwan, Republic of China
C.C. Tseng, National Chung Hsing University, Taiwan, Republic of China
Correspondent: Click to Email
TaN–(Ag,Cu) nanocomposite films were deposited by reactive co-sputtering on Si(110) substrates . The samples were then annealed using RTA (Rapid Thermal Annealing) at various temperature (200 oC ~ 400 oC) for 2, 4, 8 minutes respectively to induce the nucleation and growth of Ag/Cu particles in TaN matrix and on film surface. This study was attempted to find out if annealing temperature and mechanical properties were affected by Ag/Cu ratios. C-AFM (Conductive Atomic Force Microscopy) and FESEM (Field Emission Scanning Electron Microscopy) were used to confirm the emergence of Ag/Cu nano-particles on the surface of TaN-(Ag,Cu) thin films. Nano-indenter was used to examine the mechanical properties of the films. The results reveal that annealing temperature could be as low as 200 oC for the sample with Ag/Cu ratio at 4:6, while the hardness values could be at their highest . Accordingly, the films may be applied on polymeric substrate in the future for the purpose of anti-wear and anti-bacteria.