| AVS 56th International Symposium & Exhibition | |
| Thin Film | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | TF2-MoM1 Invited Paper ALD of Metal Chalcogenide Thin Films M.A. Leskela, T. Hatanpaa, M.J. Heikkila, V.J. Pore, M.K. Ritala, University of Helsinki, Finland |
| 9:00am | TF2-MoM3 Molybdenum ALD and Mo/W Alloy Growth Using MoF6, WF6 and Si2H6 as the Reactants D. Seghete, A.S. Cavanagh, S.M. George, University of Colorado at Boulder |
| 9:20am | TF2-MoM4 Vapor Deposition of Ruthenium Thin Films from an Amidinate Precursor H. Wang, X. Wang, Y. Lin, R.G. Gordon, Harvard University, R. Alvis, FEI Company, R.M. Ulfig, Imago Scientific Instruments |
| 9:40am | TF2-MoM5 Thermal and Remote Plasma ALD of Ru from CpRu(CO)2Et and O2 N. Leick, R.O.F. Verkuijlen, E. Langereis, Eindhoven University of Technology, The Netherlands, S. Rushworth, SAFC Hitech Limited Power Road, UK, F. Roozeboom, NXP Semiconductors Research, The Netherlands, M.C.M. van de Sanden, W.M.M. Kessels, Eindhoven University of Technology, The Netherlands |
| 10:00am | TF2-MoM6 Atomic Layer Deposition of Platinum-Iridium Mixed Metal Layers J.W. Elam, S.T. Christensen, Argonne National Laboratory |
| 11:00am | TF2-MoM9 Electrically Conductive Fiber Media by Atomic Layer Deposition of Tungsten J.S. Jur, J.-S. Na, G.N. Parsons, North Carolina State University |
| 11:20am | TF2-MoM10 Interconnect Reliability Improvement by Selective CVD of Co Capping Layer on SAM Treated Copper/Low-k Surface H.B. Bhandari, H. Park, R.G. Gordon, Harvard University |
| 11:40am | TF2-MoM11 From Chemisorption to Steady-State Growth: Initial Stages of ALD Examined using In Situ X-ray Photoelectron Spectroscopy K.J. Hughes, J.R. Engstrom, Cornell University |