| AVS 56th International Symposium & Exhibition | |
| Advanced Surface Engineering | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| SE-TuP1 Characterizations of Normal Incidence Polarizing Beam-Splitter Deposited by Glancing Angle Deposition Y.J. Park, K.M.A. Sobahan, J.J. Kim, C.K. Hwangbo, Inha University, Republic of Korea |
| SE-TuP2 Modified Glancing Angle Deposition for Making Nanostructured High Porous SiO2 Thin Films K.M.A. Sobahan, Y.J. Park, C.K. Hwangbo, Inha University, Republic of Korea |
| SE-TuP3 Microstructure and Corrosion Resistance of Nano-Crystalline ZrTiN Films on AISI 304 Stainless Steel Substrate Y.W. Lin, Instrument Technology Research Center, Taiwan, J.H. Huang, G.P. Yu, National Tsing Hua University, Taiwan |
| SE-TuP4 Light Out-Coupling Characteristics Based-on the Interfacial Electronic Structure of MoOx-doped Fullerene, a Potential Hole Ohmic-Contact Layer for Organic Semiconductor J.T. Lim, J.W. Kwon, G.Y. Yeom, Sungkyunkwan University, Korea |
| SE-TuP5 Novel Top-Down Fabrication Technique for Metallic Nanoparticles Using Microsphere Self-Assembly and Oblique Angle Thin Film Deposition M.A. Roddy, E.M. Kirkpatrick, S.R. Kirkpatrick, Rose-Hulman Institute of Technology |
| SE-TuP6 Tribological Behaviour of TiAlN/TiAlN/Pt Multilayers Deposited on Stainless Steels M. Flores, J. Garcia, E. Rodriguez, Universidad de Guadalajara, Mexico, L. Huerta, Universidad Nacional Autonoma de México, E. De las Heras, Instituto Nacional de Tecnología Industrial, Argentina |
| SE-TuP7 Physical Processes for Low Temperature Plasma Activated Wafer Bonding T. Plach, K. Hingerl, Johannes Kepler University, Austria, V. Dragoi, G. Mittendorfer, M. Wimplinger, EV Group, Austria |