AVS 56th International Symposium & Exhibition
    Plasma Science and Technology Thursday Sessions

Session PS2-ThA
Plasma Diagnostics, Sensors, and Control II

Thursday, November 12, 2009, 2:00 pm, Room B2
Moderator: C.A. Wolden, Colorado School of Mines


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

2:00pm PS2-ThA1
Absorption Spectroscopy Diagnostics of a Dual-Frequency Capacitive Dielectric Etch Tool using Ultraviolet Light-Emitting Diodes
J.-P. Booth, CNRS/Ecole Polytechnique, France, J. Bredin, LPP, France, G.A. Curley, LPN/CNRS, France
2:20pm PS2-ThA2
On-wafer Monitoring for UV/VUV Photon Irradiation during Plasma Processes
B. Jinnai, S. Fukuda, H. Ohtake, Tohoku University, Japan, E.A. Hudson, Lam Research Corp., S. Samukawa, Tohoku University, Japan
2:40pm PS2-ThA3
Influence of Argon Metastables on the Rotational Temperature of Nitrogen in Inductively Coupled Ar/N2 Plasmas
J.-S. Poirier, J. Margot, L. Stafford, P.-M. Berube, Universite de Montreal, Canada, M. Chaker, INRS-EMT, Canada
3:00pm PS2-ThA4
Electron Temperatures and Electron Energy Distribution Functions in Dual Frequency Capacitively-Coupled CF4/O2 Plasmas, Measured with Trace Rare Gases-Optical Emission Spectroscopy (TRG-OES)
Z.Y. Chen, V.M. Donnelly, D.J. Economou, University of Houston, L. Chen, M. Funk, R. Sundararajan, Tokyo Electron America
3:40pm PS2-ThA6 Invited Paper
Laser and LED based Optical Diagnostic Techniques Applied in Industrial Plasma Etch Reactors
N. Sadeghi, Université Joseph Fourier de Grenoble and CNRS-UJF-INPG, France, G. Cunge, D. Vempaire, M. Touzeau, R. Ramos, CNRS-UJF-INPG, France
4:20pm PS2-ThA8
Monitoring of Atomic H and Cl Surface Loss Kinetics by Time-Resolved Optical Emission Spectroscopy in an ICP Reactor used for Etching III-V Materials
G.A. Curley, L. Gatilova, S. Guilet, S. Bouchoule, LPN-CNRS Upr20, France
4:40pm PS2-ThA9
Real Time Control of an Inductively Coupled Plasma Simulation
B.J. Keville, M.M. Turner, Dublin City University, Ireland
5:00pm PS2-ThA10
Wafer Temperature Response During Plasma Etching and Applications to Chamber Matching
J. Shields, C. Gabriel, Spansion, Inc.
5:20pm PS2-ThA11
Plasma Etch Chamber Wall Deposits – Impact on Etch Species Density and Evaluation of Cleaning Procedures
D. Dictus, D. Shamiryan, V. Paraschiv, S. Degendt, W. Boullart, M.R. Baklanov, IMEC, Belgium, C. Vinckier, KU Leuven, Belgium