| AVS 56th International Symposium & Exhibition | |
| Plasma Science and Technology | Tuesday Sessions |
| Session PS2-TuM |
| Session: | Atmospheric Plasma Processing and Microplasmas |
| Presenter: | S.A. Starostin, Eindhoven Univ. of Technology, The Nethelands, The Netherlands |
| Authors: | S.A. Starostin, Eindhoven Univ. of Technology, The Nethelands, The Netherlands A.P. Premkumar, Materials Innovation Institute (M2i), The Netherlands M. Creatore, Eindhoven Univ. of Technology, The Netherlands H. de Vries, FUJIFILM Manufacturing Europe BV, The Netherlands R.M.J. Paffen, FUJIFILM Manufacturing Europe BV, The Netherlands M.C.M. van de Sanden, Eindhoven Univ. of Technology, The Netherlands |
| Correspondent: | Click to Email |
Atmospheric pressure plasma enhanced thin film deposition (PECVD) is nowadays in focus of increasing scientific and industrial interest. The benefits of this newly emerging technology are in possibilities for cost-efficient in-line roll-to-roll production without expensive and cumbersome vacuum equipment. Yet, comparing to the well studied low pressure PECVD, there is a serious lack of insights on thin film deposition mechanisms on the moving substrates at high pressure.
In this contribution we present a study of the deposition process of silica-like films in the diffuse high power variety of the dielectric barrier discharge referred as atmospheric pressure glow discharge (APGD) [1, 2]. This process is capable to produce uniform carbon-free silica-like films on the polymeric webs in low cost gas mixtures [2]. Considering deposition mechanisms in a roll-to-roll atmospheric PECVD reactor with a moving polymer substrate and gas flow, three different pathways which are simultaneously contributing to the film formation can be identified: a) ionic deposition, where ionized products of the decomposed precursor drift in the electric field towards the surface; b) diffusive deposition of neutral radicals produced in plasma and afterglow phases and c) deposition of large particles or dust. Due to the gas flow and depletion of the precursor, each of these mechanisms leads to layers characterized by a specific composition, morphology and location within the discharge area. In this contribution we will address the influence of the different mechanisms on film deposition, supported by space-resolved spectroscopic ellipsometry, XPS, SEM and water contact angle measurements. The experimental profiles of the deposition rate along the gas flow were analyzed with a 2D numerical convection-diffusion deposition model.
[1] S. Okazaki, M. Kogoma, M. Uehara, Y. Kimura, J. Phys. D: Appl.Phys., 26, 889, (1993)
[2] S.A. Starostin, M.A. ElSabbagh, E. Aldea, H. de Vries M. Creatore, M.C.M. van de Sanden, IEEE Trans. Plasma Sci. 36, 968 (2008)
[3] S. Starostine, E. Aldea, H. de Vries, M. Creatore, M. C.M. van de Sanden, Plasma Process Polym, 4, S440 (2007)