| AVS 55th International Symposium & Exhibition | |
| Vacuum Technology | Monday Sessions |
| Session VT-MoA |
| Session: | Vacuum Cleanliness, Outgassing, Contamination, and Gas Dynamics |
| Presenter: | O. Koizumi, Osaka Rasenkan Kogyo Co., Ltd., Japan |
| Authors: | O. Koizumi, Osaka Rasenkan Kogyo Co., Ltd., Japan N. Ogiwara, Japan Atomic Energy Agency S. Sawa, Osaka Rasenkan Kogyo Co., Ltd., Japan K. Suganuma, Japan Atomic Energy Agency M. Matsue, Osaka Rasenkan Kogyo Co., Ltd., Japan |
| Correspondent: | Click to Email |
One of the performances required for gas feed system in semiconductor manufacturing equipment is to be particle free. To meet this requirement the inner surface of the bellows must be smoothed and cleaned. This problem for the pipe and mechanical processed parts has been already resolved by combination with electro polishing or electro mechanical buffing, etc., and cleaning. However, for the bellows we could polish the inner surface smooth but not evenly because it is formed in bellows shape. Therefore we established wet mechanical polishing with which it is possible to polish the inner surface of the bellows smooth and even. The feature of this polishing is that you can completely polish the entire inner surface of the bellows by mixing abrasive in the liquid. We finally obtained the inner surface roughness less than Ra=0.05μm for the bellows.Furthermore we realized to be particle free by combing this polishing and cleaning.Also we are planning to report the outgassing rate form the bellows which applied this wet mechanical polishing.