AVS 55th International Symposium & Exhibition
    Biomaterial Interfaces Tuesday Sessions
       Session BI-TuP

Paper BI-TuP19
Surface Characterization of PEG-like Film Made by Using Ethylene Glycol Precursor and Capacitively Coupled Plasma Chemical Vapor Deposition

Tuesday, October 21, 2008, 6:30 pm, Room Hall D

Session: Biomaterials Interfaces Poster Session with Focus on Cells and Proteins at Interfaces
Presenter: C. Choi, Sungkyunkwan University, Korea
Authors: C. Choi, Sungkyunkwan University, Korea
S. Lee, Sungkyunkwan University, Korea
D. Jung, Sungkyunkwan University, Korea
D.W. Moon, Korea Research Institute of Standards and Science (KRISS)
T.G. Lee, Korea Research Institute of Standards and Science (KRISS)
Correspondent: Click to Email

Polyethylene-glycol (PEG) is widely used for various biological applications because of its anti-fouling property for protein and cells, and non-toxicity in the human body. Since the PEG thin film should have the properties of reproducibility and adhesiveness on various substrates, in this work, plasma-polymerized ethylene glycol (PPEG) thin film was deposited on a glass surface by using the capacitively coupled plasma chemical vapor deposition (CCP-CVD) method and ethylene glycol as a precursor. The PPEG thin films were characterized by using contact angle measurement, X-ray photoelectron spectroscopy (XPS) and time-of-flight secondary ion mass spectrometry (TOF-SIMS) along with a principal component analysis (PCA). The PPEG surface was controlled in a reproducible manner as a function of sample bias plasma power and was correlated with the surface chemical composition. Of interest, we found that PPEG thin film surfaces deposited at low plasma power were similar in chemical composition to the PEG polymer surface. In addition, by using the fluorescence detection method, we found that the PPEG surface showed an anti-fouling property of immunoglobulin G protein, which was tagged by fluorescein isothiocyanate. Our results showed that this PEG-like PPEG surface would be useful for protein chip applications.