AVS 54th International Symposium
    Vacuum Technology Thursday Sessions
       Session VT-ThM

Paper VT-ThM8
A Non-Destructive Partial Pressure X-Ray Analysis Method for Kr and Xe Gas Filled Encapsulated Devices

Thursday, October 18, 2007, 10:20 am, Room 618

Session: Pumping, Pressure Measurement and Calibration
Presenter: P.F. Somssich, Osram Sylvania
Authors: P.F. Somssich, Osram Sylvania
K.J. Zuk, Osram Sylvania
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A method to non-destructively measure the gas fill pressure of glass-encapsulated gas devices, e.g. lighting products will be described. The technique, first developed at GTE Laboratories in Waltham, MA, has recently been further expanded to include a wider range of devices (0.02cc and above) and pressures (15 Torr to 10 Atm.), all of which contain a xenon or krypton fill gas. When analysis results of an EDXRF instrument are combined with that of an absolute pressure-volume analyzer, calibration curves were generated allowing for subsequent non-destructive fill pressure determinations with an accuracy of approx. +/- 10%. The EDXRF analysis generates additional useful qualitative information which will also be presented, e.g. detecting the presence of iodine and other salts. Possible applications for 100% quality testing of products using a variant of the test, sub-second analysis, will be discussed.