AVS 54th International Symposium
    Tribology Friday Sessions
       Session TR4+SE-FrM

Paper TR4+SE-FrM12
Effects of Annealing on Anti-Wear and Anti-Bacteria Behaviors of TaN-Cu Thin Films

Friday, October 19, 2007, 11:40 am, Room 617

Session: Friction and Wear of Engineered Surfaces Macro- to Nanoscale Approaches
Presenter: J.H. Hsieh, Mingchi University of Technology, Taiwan
Authors: J.H. Hsieh, Mingchi University of Technology, Taiwan
M.K. Cheng, Mingchi University of Technology, Taiwan
Y.K. Chang, Mingchi University of Technology, Taiwan
S.H. Chen, National Chiayi University, Taiwan
P.C. Liu, Mingchi University of Technology, Taiwan
Correspondent: Click to Email

TaN–Cu nanocomposite films were deposited by reactive co-sputtering on Si and tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 ?C for 2, 4, 8 minutes respectively to induce the nucleation and growth of Cu particles in TaN matrix and on film surface. C-AFM (Conductive Atomic Force Microscopy) and FESEM (Field Emission Scanning Electron Microscopy) were used to confirm the emergence of Cu nano-particles on the surface of TaN-Cu thin films. The effects of annealing on anti-wear and anti-bacteria properties of these films were studied. The results reveal that annealing by RTA can cause Cu nano-particles with various dimensions to emerge on the TaN surface. Accordingly, hardness and friction coefficients will change, as well as the anti-bacterial behavior.