AVS 54th International Symposium
    Thin Film Friday Sessions
       Session TF2-FrM

Paper TF2-FrM8
The Characterization of Stress Induced Crystallization of Polycrystalline Silicon Thin Film Transistor with Vertically Aligned Carbon Nanofibers

Friday, October 19, 2007, 10:20 am, Room 613/614

Session: Nanoparticles
Presenter: J. Park, The University of Tennessee
Authors: J. Park, The University of Tennessee
S.Y. Kwon, The University of Tennessee
S.-I. Jun, dpiX
A.V. Melechko, Oak Ridge National Laboratory
T.E. McKnight, Oak Ridge National Laboratory
M.L. Simpson, Oak Ridge National Laboratory
P.D. Rack, The University of Tennessee
Correspondent: Click to Email

Thin film transistors (TFT) with vertically aligned carbon nanofibers (VACNF) are an attractive electronic switching device for nanoscale electroanalysis and delivering biological material into live cells. In our previous work, we have demonstrated an amorphous silicon TFT array integrated with VACNFs for delivering biological material into live cells. To enhance the device performance, we have explored a polycrystalline silicon active layer with a bottom-gate structure. For the poly silicon device, source/drain and gate metals and gate dielectric thin films were RF magnetron sputter deposited. We have examined several enhanced crystallization strategies including DC bias stress during amorphous silicon deposition and stress induced crystallization (SIC) using dielectric silicon nitride caps with relatively lower process temperature and higher crystallinity silicon than conventional annealing. The silicon films have been characterized by x-ray diffraction, scanning electron microscopy, and Raman spectroscopy. In this presentation, we will demonstrate the process flow of fabricating polycrystalline silicon with the stress effects and the characteristics of polycrystalline silicon will be discussed. Furthermore, the electrical characteristics of the TFTs with this active layer will be demonstrated.