AVS 54th International Symposium
    Nanometer-scale Science and Technology Wednesday Sessions
       Session NS+EM-WeM

Paper NS+EM-WeM6
Plasma-stimulated Control of Silicon Nanowire Nucleation, Orientation and Growth Kinetics

Wednesday, October 17, 2007, 9:40 am, Room 616

Session: Nanoscale Devices and Nanowires I
Presenter: S.T. Picraux, Los Alamos National Laboratory
Authors: P. Aella, Arizona State University
W.T. Petuskey, Arizona State University
S.T. Picraux, Los Alamos National Laboratory
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Plasma-enhanced chemical vapor deposition is shown to significantly alter the nucleation rate and activation energy for vapor-liquid-solid (VLS) growth of silicon nanowires compared to thermal growth, providing new control over nanowire morphologies and new insight into the rate-limiting mechanisms of VLS growth. Initially, catalytic gold films (0.5 - 2 nm thick) were thermally evaporated onto hydrogen terminated Si (100) substrates at room temperature in a UHV deposition system. Subsequently, Si nanowires were grown in a cold wall reactor at 0.5 Torr in atmospheres of 10% SiH4 in H2 between 350 to 510ºC and RF plasma powers of 2.5 to 10 W. SEM images show that thermally grown nanowires on Si (100) substrates nucleate and grow predominantly in <111> directions. In contrast, plasma stimulation significantly enhances the nucleation rate of smaller diameter <110> Si nanowires and also reduces coarsening of Au dots. A two step growth process is demonstrated whereby initial plasma excitation nucleates <110> nanowires followed by thermal growth to preferentially form a high density of small diameter <110> nanowires on Si (100) surfaces, greatly limiting the large diameter <111> nanowire formation found under thermal growth conditions with identical Au seeding. This demonstrates the overall effect of the plasma on shortening nucleation times, favoring thinner wires, and thereby dominating the rest of the growth process. A comparison of the growth rate vs. temperature for both <111> and <110> nanowires shows a large reduction in the activation energy (from 0.74 to 0.26 eV) due to the plasma. The overall growth rate is also greatly enhanced at low temperatures by plasma excitation, with growth rates at 350ºC an order of magnitude greater than for thermal growth. Under our low temperature thermal conditions the predominant source gas is silane, while in the case of plasma stimulation SiH3 radicals are also present. Our results unequivocally demonstrate that the rate limiting step for Si nanowire growth under these conditions is due to the kinetics of silicon incorporation at the vapor-liquid interface and not at the liquid-solid interface as has also been previously proposed in some cases. Based on our measured incorporation coefficients and activation energies under thermal and plasma-enhanced growth we suggest the first model for the rate-limiting kinetic steps for Si nanowire growth by the VLS mechanism.