AVS 51st International Symposium
    Organic Films and Devices Tuesday Sessions
       Session OF-TuP

Paper OF-TuP2
Investigation on the Interfacial Reaction of Metal/Fluorinated Polymide

Tuesday, November 16, 2004, 4:00 pm, Room Exhibit Hall B

Session: Poster Session
Presenter: C.-Y. Yang, National Cheng Kung University, Taiwan
Authors: C.-Y. Yang, National Cheng Kung University, Taiwan
S.L.-C. Hsu, National Cheng Kung University, Taiwan
J.-S. Chen, National Cheng Kung University, Taiwan
Correspondent: Click to Email
In this work, the surface states of fluorinated polyimide synthesized from 6FDA-BisAAF-PPD, before and after plasma treatment, were characterized by X-ray photoelectron spectroscopy (XPS). The interfacial states of metal-fluorinated polyimide were examined by XPS after metal films of Cu, Cr and Au were deposited onto the fresh cured fluorinated polyimide with or without plasma treatment. The influence of plasma treatments on interfacial reaction was examined. XPS analysis results reveal that the surface of fluorinated polyimide will be oxidized and nitridated after O2 and N2 plasma treatment. In the metal/polyimide interface, chemical bonding of Cr-C is observed in the untreated polyimide system. However, no metal-carbon bonding is found in the Cu, Au and polyimide interface. Slight interface change is observed after the N2 plasma treatment. In addition to M(metal)-C bonding, M-C-O bonding is also observed at the metal-polyimide interface in those samples with O2 plasma applied to the polyimide surface. The relationship between adhesion and interfacial reaction of metal/fluorinated polyimide, and the role of fluorine in the interfacial reaction are also discussed.