AVS 51st International Symposium
    Organic Films and Devices Thursday Sessions
       Session OF+EM-ThA

Paper OF+EM-ThA3
Plasma Damage-Free Deposition of Metal and ITO Electrodes on Organic Light Emitting Diodes by Using Mirror Shape Target Sputtering(MSTS)

Thursday, November 18, 2004, 2:40 pm, Room 304C

Session: Molecular and Organic Films and Devices - Optoelectronic
Presenter: H.-K. Kim, Samsung SDI, Korea
Authors: H.-K. Kim, Samsung SDI, Korea
D.-G. Kim, Samsung SDI, Korea
K.A. Lee, Samsung SDI, Korea
M.-S. Huh, Samsung SDI, Korea
S.H. Jeong, Samsung SDI, Korea
K.I. Kim, Samsung SDI, Korea
Correspondent: Click to Email
We report a successful fabrication of plasma damage-free organic light-emitting diodes (OLED) by using a mirror shape target sputter (MSTS) technique. Compared to leakage current (1*10@super-1@ ~10@super-2@mA/cm@super2@ at -6V) of the OLED consisted of Al cathode grown by conventional DC magnetron sputtering, that of the OLED with an Al cathode grown by MSTS shows much lower leakage current at reverse bias (1*10@super-5@ mA/cm@super2@ at -6V), indicative of no plasma damages. Therefore, the MSTS technique is expected to be useful in plasma damage-free and low temperature deposition technique for top and bottom-emitting OLEDs and flexible OLED. Possible mechanism is given to explain plasma damage free deposition of the metal and ITO electrodes by using current-voltage characteristics, SEM, AFM, XRD, and TEM examinations.