AVS 51st International Symposium
    Manufacturing Science and Technology Tuesday Sessions
       Session MS-TuP

Paper MS-TuP9
Impact of Reconditioned PVD Shielding on Process Yield

Tuesday, November 16, 2004, 4:00 pm, Room Exhibit Hall B

Session: Poster Session
Presenter: G.H. Leggett, QuantumClean
Authors: D.J. Zuck, QuantumClean
G.H. Leggett, QuantumClean
D.S. Zuck, QuantumClean
Correspondent: Click to Email
Process control is impacted by many variables in the chamber of a semiconductor process tool. Process chambers often have shielding that is removable and can be reprocessed for reuse. The effective reprocessing of this shielding can have a dramatic impact on process performance. The process deposition must be removed completely and additional contaminates can not be added to the shielding. The shielding is in close proximity to the wafer surface and often can transfer contaminates to the wafer. This shielding can include clamp rings which can contact the wafer in the edge ring exclusion area. The surface condition of this shielding must be maintained. The typical cleaning methodology for the removal of metal deposits from stainless steel shielding is corrosive and can attack the underlying base metal. Changes in surface morphology and finish can result in shorter lifetimes for parts and also have an impact on process yield. Particle contamination can result from shielding that does not have the proper surface morphology and/or surface preparation. A methodology was developed to monitor the surface condition and recondition the part when this surface morphology has deteriorated to a point where it has an impact on process yield. A method was further developed that reconditioned the surfaces and improved the lifetime of these parts. Data will be presented on the mobile ionic contamination of the parts as well as the surface finish and its impact on process performance. A comparison of surface finish with process performance will be described.