AVS 51st International Symposium
    Manufacturing Science and Technology Wednesday Sessions
       Session MS+AS-WeA

Invited Paper MS+AS-WeA2
Non-Destructive Ultra-Thin Film (0-100A) Analysis in the Lab and the Fab.

Wednesday, November 17, 2004, 2:20 pm, Room 303B

Session: Non-Destructive Analysis and Metrology for Advanced Manufacturing
Presenter: C.R. Brundle, C. R. Brundle and Associates
Correspondent: Click to Email
Whether for characterization or failure analysis work in the support laboratory, or for rapid quality control/metrology in a wafer processing fab, the need for analytical techniques capable of determining thickness, composition, and composition as a function of depth (including differences at interfaces) is increasing as the variety of film material used in processing expands, and as films and stacks get thinner. The current materials roster, and the stringency of analytical requirements are briefly reviewed, then four non-destructive techniques being deployed in lab and fab situations are discussed and their capabilities compared for these two different environments. They are X-Ray Fluorescence, XRF; X-Ray Reflectivity, XRR; X-Ray Photoelectron Spectroscopy, (XPS and angle resolved XPS); and Low Energy X-Ray Emission spectroscopy, LEXES.