AVS 51st International Symposium
    MEMS and NEMS Monday Sessions
       Session MN-MoP

Paper MN-MoP6
Wafer Scale Replication of a Micro-well Array Assay Chip

Monday, November 15, 2004, 5:00 pm, Room Exhibit Hall B

Session: Poster Session
Presenter: M.W. Lee, Inha University, South Korea
Authors: M.W. Lee, Inha University, South Korea
S.-B. Jo, Inha University, South Korea
K.-C. Lee, Inha University, South Korea
K.J. Lim, Inha University, South Korea
J.K. Suh, LGLS, South Korea
B.-H. O, Inha University, South Korea
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Technological issues regarding microfabrication of a micro-well array chip are presented. Microfabrication processes have been widely used to make a micro-mold using micromachining processes based on the semiconductor fabrication processes. Its intermediate product is a wafer mold. It can be used as a parent of other molds, like a Ni electroplated mold. Or, the intermediate wafer can be used as a mold directly for a polymer replica. In this study, polymer replication processes using an intermediate wafer, a Ni electroplated mold, and a wafer mold coated with anti-adhesive layer are performed and the corresponding characteristics are compared. Target device is a polymer based micro-well array assay chip. The Si wafer was patterned conventionally and etched by using ICP. The Ni mold showed good performances for replicating the polymer assay chip. As it was not adequate to use the intermediate as-etched Si wafer as a mold for the polymer replication due to the adhesion problem, Teflon-like film was coated as an anti-adhesive layer on top of it. Replication performance of the film coated wafer mold was good enough to replace the Ni mold. Multiple replications were carried using the coated wafer without stiction problems, enough to be used as a mold in a mass replication process.