AVS 51st International Symposium
    MEMS and NEMS Monday Sessions
       Session MN-MoA

Paper MN-MoA5
Dielectrophoretic Assembly and Integration of Functional Nanodevices with VLSI Circuitry

Monday, November 15, 2004, 3:20 pm, Room 213C

Session: Micro and Nano Fabrication Techniques for MEMS and NEMS
Presenter: S. Evoy, The University of Pennsylvania
Authors: S. Evoy, The University of Pennsylvania
Y. Dan, The University of Pennsylvania
A. Narayanan, Virginia Tech
S. Raman, Virginia Tech
Correspondent: Click to Email
The bottom-up synthesis and integration of nanoscale structures open new opportunities for the development of functional integrated systems with respect to reduced size, power consumption, and increased range of materials and functionalities that can be accessed. We present a novel platform for the development and deployment of nanosensors in integrated systems. The nanosensor technology is based on cylindrical structures grown using porous membranes as templates.@footnote 1@ These nanostructures are manipulated using dielectrophoretic forces, allowing their individual assembly and characterization. The assembly and electromechanical characterization of Rh rods and carbon nanopipes (MWNT) was performed. In addition, these segmented growth technologies have already allowed the development of striped nanowires consisting of a central functional segment terminated by two metallic extremities. @footnote 2@ Further development of such gold-terminated structures would allow assembly of sensing devices in which the metal/metal contact point would represent a negligible contribution compared to the chemresistive response of the central segment. We also report on the successful integration of nanodevices with mixed mode circuitry fabricated in a 0.18 um BiCMOS process. We were successfully able to assemble Rh nanorods of approximately 5 um in length onto prefabricated a CMOS Wheatsone bridge circuitry. We report on the designs of such mixed mode systems whose layouts integrate dielectrophoretic assembly sites with a resistance read-out, signal processing, and wireless communication circuitries. @FootnoteText@ @footnote 1@ S. Evoy, B. Hailer, M. Duemling, W. Barnhart, S. Raman, B. R. Martin, T E. Mallouk, I Kratochvilova, and T. S. Mayer, MRS Symp. Proc., 687, 63-68 (2002). @footnote 2@ S. Evoy, et al , "Dielectrophoretic assembly and integration of functional nanostructures with CMOS operating circuitry", Micro. Eng. (in press).