AVS 51st International Symposium
    MEMS and NEMS Tuesday Sessions
       Session MN+MS+PS+TF-TuA

Invited Paper MN+MS+PS+TF-TuA1
Wafer-Level, Low-Cost, High-Vacuum Packaging of MEMS Devices Using Nanogetter TM

Tuesday, November 16, 2004, 1:20 pm, Room 213C

Session: Nano/MEMS Manufacturing and Plasmas
Presenter: N. Najafi, Integrated Sensing Systems, Inc. (ISSYS)
Authors: N. Najafi, Integrated Sensing Systems, Inc. (ISSYS)
D.S. Sparks, Integrated Sensing Systems, Inc. (ISSYS)
Correspondent: Click to Email
As part of its development effort to commercialize a Micro-Density Meter, ISSYS Inc. invented a new technology for long-term, low-cost, wafer-level, high-vacuum, hermetic encapsulation of MEMS devices. This technology is now commercially available through a spin-off company: Nanogetter Inc. At the system level perspective, one of the most attractive features that NanogetterTM offers to the MEMS community is a "Total Solution" to an important problem facing many emerging MEMS products. Nanogetters Inc. technology offers: Wafer-level, high-vacuum (< 1mTorr) encapsulation, Long-term vacuum stability, Hermetic electrical lead transfer, Compatibility with all MEMS technologies (polysilicon surface, bulk, silicon-on glass, and LIGA micromachining technologies), High yield, Low cost In addition to high-vacuum packaging applications, NanogetterTM will be further developed to provide ambient environments suitable for applications requiring higher pressures. For example, for micro-switches and accelerometers, the technology will absorb humidity and oxygen. As a testbed for using this wafer-level, high-vacuum technology, the performance of a micro-density meter will be presented.