AVS 51st International Symposium
    Materials Solutions for Cooling Technology Topical Conference Monday Sessions
       Session CT-MoA

Invited Paper CT-MoA7
Liquid Cooling Technologies for Microprocessors

Monday, November 15, 2004, 4:00 pm, Room 303B

Session: Material Solutions for Chip Cooling
Presenter: T.W. Kenny, Stanford University
Authors: T.W. Kenny, Stanford University
K.E. Goodson, Stanford University
J.S. Santiago, Stanford University
M. Munch, Cooligy, Inc.
G. Upadhya, Cooligy, Inc.
D. Werner, Cooligy, Inc.
M. McMaster, Cooligy, Inc.
Correspondent: Click to Email
Recent trends in processor power for the next generation devices point clearly to significant increase in processor heat dissipation over the coming years. In the desktop system design space, the tendency has been to minimize system enclosure size while maximizing performance, which in turn leads to high power densities in future generation systems. The current thermal solutions used today consist of advanced heat sink designs and heat pipe designs with forced air cooling to cool high power processors. However, these techniques are already reaching their limits to handle high heat flux, and there is a strong need for development of more efficient cooling systems which are scalable to handle the high heat flux generated by the future products. To this end, a new closed loop liquid cooling system has been developed to handle heat fluxes greater than 500 W/sq cm. The cooling system comprises a micro channel heat exchanger for high heat flux removal capability, an electro-kinetic pump for delivering fluid with required flow rate and pressure, coupled with a counterflow heat rejecter to dissipate heat to the ambient. This talk will describe the components of this technology and discuss the process taken to transition from DARPA-Funded academic research to venture-funded startup to successful company.