TOPICAL CONFERENCES & SPECIAL SESSIONS LINKS

AIP Industrial physics forum	In-Situ Electron Microscopy	Marine Biofouling
Nano Manufacturing	Plasmonics	Tribology
	Understanding Biointerphases &  Magnetism with Neutrons

The 54th AVS International Symposium and Exhibition will be held at the Washington State Convention Center, Seattle, WA from 14-19 September 2007. Given the number of abstracts submitted, the strength of their technical content, and diversity of technical themes for the Seattle meeting, we expect very strong participation/ attendance. (Last year over 2500 registrants from academia, industry, and government attended.) The meeting, which is synopsized below, features a dynamic program of 121 technical sessions plus 2 poster sessions comprising over 1300 papers in the forefront of materials, interfaces, and processing research. Distinguished invited speakers, leaders in their respective research areas, are featured in many of the technical sessions. We’ve added Exhibitor Workshop sessions where one can learn the latest AVS-related technical/technological advances in the marketplace. We are certain you will learn something from the programming at the 54th AVS meeting that will enhance you professionally. We look forward to your participation

Advanced Surface Engineering
The Advanced Surface Engineering Division (SE) Program is expanding its interest in new materials, technologies, characterization, manufacturing, applications, and fundamentals of surface engineering. This year, the program starts on Monday morning with a session focusing on the interrelationships between synthesis, structure, and properties of hard and nanocomposite coatings, with invited presentations from both industry and academia, focusing on the industrial scale coating deposition (J. Vetter, Sulzer Metaplas GmbH, Germany) and the atomistic processes during layer deposition (I. Petrov, University of Illinois), respectively, followed in the afternoon by a session on the emerging pulsed plasma technique to create highly ionized deposition, with invited talks by L. Martinu and A.P. Ehiasarian. The session on “Glancing Angle Deposition” on Tuesday morning includes presentations from the world leaders in this new nanostructure growth technique, with an invited talk by M.J. Brett from the Univ. of Alberta. The afternoon session on “Naturally and Artificially Nanolaminated Coatings” features two invited presentations on MAX phases by J.M. Schneider and H. Högberg, and more contributed talks on glancing angle deposition. The Wednesday morning session on “Photocatalytic Coatings” will host various contributed presentations focusing on synthesis and reactivity of TiO2 coatings and related materials, and includes invited talks by K.A. Gray from Northwestern University on nano-scale photocatalytic films and by A. Fujishima from the Kanagawa Academy of Science and Technology on the present and future of photocatalytic coatings. In addition, the Advanced Surface Engineering Division sponsors a poster session on Tuesday evening and co-sponsors a session on “Friction and Wear of Engineered Surfaces” on Friday morning.

CODE		SESSION
SE-MoM		Hard and Nanocomposite Coatings: Synthesis Structure, and Properties I. Petrov, Univ. of Illinois, Urbana-Champaign J. Vetter, Sulzer Metaplas GmbH, Germany
SE+PS-MoA		Pulsed Plasmas in Surface Engineering A.P. Ehiasarian, Sheffield Hallam Univ., UK L. Martinu, Ecole Polytechnique, Canada
SE-TuM		Glancing Angle Deposition M.J. Brett, University of Alberta, Canada
SE-TuA		Naturally and Artificially Nanolaminated Coatings H. Högberg, Linköping University, Sweden J.M. Schneider, RWTH Aachen Univ., Germany
SE-TuP		Advanced Surface Engineering Poster Session
SE-WeM		Photocatalytic Coatings A. Fujishima, Kanagawa Academy of Science and Technology, Japan K.A. Gray, Northwestern University

Applied Surface Science
The Applied Surface Science Division contains a solid program of traditional sessions and provides a strong showing of papers in exciting new topics that expand the range of the division. We have an excellent array of invited talks, contributed talks, and poster presentations. The program opens with two special sessions to honor the seminal and sustained contributions of Cedric Powell (NIST) and Martin Seah (NPL) in advancing state-of-the-art quantitative surface analysis. D. Baer will open the first session focused on Electron Spectroscopies with a summary of progress to date and needs for the future. C. Powell will discuss advances that have been made to calibrate instruments, assess surface sensitivity, and account for elastic scattering of the signal electrons. J.C. Vickerman will open the second special session focused on Ion Spectroscopies by describing the use of cluster ion beams and how they have enhanced the capabilities of SIMS in biomaterial analysis. M. Seah will then discuss the development of models predicting secondary ion yield as they apply to these new cluster ion sources. L. Renaud will continue with a talk on the emerging technique of atom probe microscopy, a method for atomic scale 3-D elemental mapping.

One of the great challenges for bioengineering is to understand the surface structure and chemistry of biological and functional materials. D.W. Moon will discuss recent research aimed at understanding the surface chemistry of cells. New analytical equipment and high-speed computing on desktop computers opens the possibility of three-dimensional analysis with new and emerging techniques. C.F. Kisielowski (LBNL) will discuss the challenges and promise for electron tomographic analysis of materials, atomic resolution with chemical specificity. P.S. Weiss will continue with a discussion of how the scanning tunneling microscope is used to exploit molecular interactions in order to form precise molecular assemblies, nanostructures, and patterns. C. Eggleston will discuss the use of optical spectroscopies to study natural geochemical systems at the molecular level through the investigation of the solid-liquid interface. P.T. Lillehei will address the modification of the surfaces of materials of aerospace platforms. Finally, P.V. Braun will describe the fabrication of complex planer and 3-dimensional structures for control of photon, electron and chemical transport.

Division Sponsors
CODE		SESSION
AS-MoM		Quantitative Surface Analysis I. Electron Spectroscopies: (Honoring the contributions of Martin Seah, NPL, & Cedric Powell, NIST) D.R. Baer, Pacific Northwest National Lab. C.J. Powell, NIST J. Walton, The University of Manchester, UK
AS-MoA		Quantitative Surface Analysis II. Electron Spectroscopies: (Honoring the contributions of Martin Seah, NPL, & Cedric Powell, NIST) L. Renaud, CAMECA, France M.P. Seah, National Physical Lab., UK J.C. Vickerman, The Univ. of Manchester, UK
AS+BI+NS-TuM		Surface Analysis and Related Methods for Biological Materials D.W. Moon, Korea Research Institute of Standards and Science
AS-TuA		3-Dimensional Characterization C.F. Kisielowski, Lawrence Berkeley Nat. Lab.
AS-TuP		Aspects of Applied Surface Science Poster Session
AS-WeM		Chemical Imaging at High Spatial Resolution and Nanoscale Materials C.M. Eggleston, University of Wyoming P.T. Lillehei, NASA Langley Research Ctr P.S. Weiss, The Pennsylvania State Univ.
AS+BI+NS-WeA		Fabrication and Characterization of Functional Soft Material Surfaces P.V. Braun, U. of Illinois, Urbana-Champaign
AS-ThP		Aspects of Applied Surface Science II Poster Session

Biomaterial Interfaces
In the tradition of the Biomaterial Interfaces Division (BID), a broad technical program has been established, incorporating fundamental bio-interfacial analytical techniques, nanobiomaterial synthesis, micro-fabrication and fluidics, interfacial phenomena, complex biological systems, applied technologies and devices. The program includes sessions devoted to a wide range of biomaterial interfaces from macromolecular (protein, DNA) to supramolecular (phospholipid bilayer membranes) to cellular. The BID technical program seeks to provide a forum that explores the current challenges at the interface of materials, biological systems, technique development and surface science. Progress in biotechnologies, biomedical devices, prominent industrial problems in the environment and medicine, and methods to evaluate and interrogate complex biological system-interfaces is the primary objective. Advances in materials science, instrumentation, theoretical models, and practical bio-interfacial capabilities continue to be emphasized in this forum. The BID is participating in the new programmatic formalism of AVS cross-cutting Featured Topics in Tribology and Plasmonics Topical Conference. In the Tribology area, BID is co-sponsoring a session on Bio-lubrication, Sensing and Adhesion; in the Plasmonics area, BID sponsors a session on Plasmon-Mediated Biosensing. BID has also assembled a new, featured BID Topical Conference on Marine Biofouling.

The Biomaterial Interfaces Division (BID) has proudly opened the AVS International Meeting with its Sunday afternoon Plenary Session (BP) for years. The event serves to provide an open venue for interdisciplinary exchange, where new, inspiring and emerging ideas in science and technology are presented and discussed as approaches to critical societal problems. The Plenary Session emphasizes talks geared toward a general AVS audience and is open to all in order to promote interactions necessary to move fields forward through “out-of-the-box” thinking. This year’s three plenary lectures will present recent technological approaches to the daunting problems of addressing public health needs on a global scale. Thus, the Plenary Session on Global Health Technologies will open with a talk describing forward-looking methods of solving problems associated with common human parasites such as those that cause malaria (R. Darvasula, Univ. of New Mexico). The session then moves specifically toward diagnostics technologies including low cost methods for diagnosing HIV infection (W. Rodriguez, Harvard Univ. Medical School). The Plenary Session wraps up with a talk closely related to surface science, measurement and device technologies with P. Yager, (Univ. of Washington) presenting on the development of a new multiplexed, low-cost point-of-care diagnostic system for use in the developing world. These plenary lectures provide a spectrum of technological approaches for addressing one of the most pressing and difficult challenges facing our modern global society.

CODE		SESSION
BP-SuA		Global Health Technologies R.V. Durvasula, U. of New Mexico School of Medicine W.R. Rodriguez, Harvard Medical School P. Yager, University of Washington
BI-TuM		Proteins at Interfaces D.L. Elbert, Washington University J.W. Heinecke, University of Washington
BI-TuA		Engineered Cellular Interfaces K.D. Hauch, University of Washington K.K. Parker, Harvard University
BI-TuP		Biomaterials Interfaces Poster Session
BI-WeM		Nano-Engineered Biointerfaces X. Gao, University of Washington S.H. Pun, University of Washington
BI-WeA		Nucleic Acid Sequencing and Technology A.E. Barron, Stanford University J.S. Edwards, University of New Mexico
BI-ThM		Biomimetic Phospholipid Interfaces K. Hristova, Johns Hopkins University A. Parikh, University of California, Davis
BI+AS+NS-ThA		Surface Analysis and Related Methods for Biological Materials S.G. Boxer, Stanford University
BI-ThP		Biomaterial Interfaces Poster Session
BI-FrM		Microbioanalytical Systems F.A. Gomez, California State U., Los Angeles B.A. Parviz, University of Washington

Electronic Materials and Processing
The Electronic Materials (EM) and Processing Division sponsors sessions on electronic materials growth, processing and characterization. The technical sessions and posters cover the areas of compound semiconductors (including zinc oxide), wide band-gap semiconductors, semiconductor contacts, high-K dielectrics, complex oxides, semi-conductor nanostructures for electronics/optoelectronics, organic electronics and molecular electronics. We are also co-sponsoring a special topical session on renewable energy and regular sessions with the Surface Science, Thin Films, and Magnetic Interfaces and Nanostructures Divisions.

The EM Program starts on Sunday afternoon with a special topical conference on renewable energy. The main technical program for EM starts on Monday morning with a session on Organic Electronics Materials and Devices, featuring an invited talk by R.A. Street of the Palo Alto Research Center (PARC). The Monday afternoon session will introduce the topics of Semiconductor Nanostructures for Electronics and Optoelectronics. A Molecular Electronics session, featuring an invited talk by J. Kushmerick of NIST, is scheduled for Tuesday morning. On Tuesay afternoon, the Semiconductor Nanostructures for Electronics and Optoelectronics topic will continue, in a session featuring the Medard W. Welch Award lecture presented by J. Tersoff of IBM T. J. Watson Center, as well as an invited talk by J. Xu from Pennsylvania State University.

The Wednesday morning session will address Contacts, Interfaces and Defects in Semiconductors, and includes an invited talk by R. Okojie of NASA. On Wednesday afternoon, a session on Growth and Characterization of Complex Oxides features an invited talk by D. G. Schlom of Pennsylvania State University. A Zinc Oxide session, with an invited talk by D. C. Look of Wright State University, is scheduled for Thursday morning. The Thursday afternoon session is on High-K/High Mobility Substrates and Power Electronics, and features an invited talk by K.D.T. Ngo of Virginia Tech. The EMPD poster session will be held on Thursday, starting at 5:30 pm. The EMPD sessions conclude on Friday morning with a session on Hafnium-Based Dielectrics and Their Interfaces, featuring an invited talk by S. Samavedam of Freescale.

CODE		SESSION
EM-MoM		Organic Materials and Devices R.A. Street, Palo Alto Research Center
EM+NS-MoA		Semiconductor Nanostructures for Electronics and Optoelectronics I
EM-TuM		Molecular Electronics J.G. Kushmerick, NIST
EM+NS-TuA		Semiconductor Nanostructures for Electronics and Optoelectronics II J. Tersoff, IBM T.J. Watson Center* J. Xu, Pennsylvania State University
EM-WeM		Contacts, Interfaces and Defects in Semiconductors R.S. Okojie, NASA Glenn Research Center
EM-WeA		Growth and Characterization of Complex Oxides D.G. Schlom, Penn State University
EM-ThM		Zinc Oxide D.C. Look, Wright State University
EM-ThA		High-K/High Mobility Substrates and Power Electronics K.D.T. Ngo, Virginia Tech P.D. Ye, Purdue University
EM-ThP		Electronic Materials & Processing Poster Session
EM-FrM		Hf-based Dielectrics and Their Interfaces

Magnetic Interfaces and Nanostructures
The Magnetic Interfaces and Nanostructures (MIN) Division will present a series of symposia highlighting recent advances in magnetic nanostructures/nanoparticles, thin films, magnetic transport, and magnetic imaging/spectroscopy. Rapid advancement in these areas has fueled intensive growth in magnetic recording, magnetic sensors, and magneto-electronics. Exciting new advances in magnetic imaging and spectroscopy are pushing the boundaries on our understanding of magnetic materials from the micro- to nano-scale.

The MIN Division will host five oral sessions including two joint sessions with the Electronic Materials Program (EM) and one joint session with the Thin Film Division. We also host the Leo M. Falicov Award competition for the best graduate student research and presentation in this division. The finalists are selected on the basis of advisor recommendations and the quality of the submitted abstracts. The five finalists are: S.W. Cho, Seoul National University; J. R. Skuza, the University of Toledo; J. P. Strachan, Stanford University; M. J. Walock, the University of Alabama; D. S. Wisbey, University of Nebraska-Lincoln. 

Three judges will select the winner of the Falicov Award based on the quality of the research and the presentation. The award will be presented during the break in the Thursday afternoon session.

On Wednesday morning, we will begin the MIND Program with a session on Magnetic Thin Films and Nanostructures. Talks by the invited speakers include recent progress of surface magnetism of half-metallic materials, and interaction-induced collective behavior in magnetic nanodot assemblies. This session emphasizes the fundamental aspects of magnetic properties of low-dimensional and nanostructured materials. The Wednesday afternoon session focuses on progress in magnetic imaging and spectroscopy. The invited speakers will introduce two promising techniques for imaging magnetic structures with the best time and spatial resolution. Both morning and afternoon sessions on Thursday focus on the latest research on magnetic semiconductors. The morning begins with an invited talk that reviews the standard (III,Mn)V dilute magnetic semiconductor systems and extrapolates away from them toward new types of semiconductors. An invited talk also begins the afternoon session, and discusses Mn-doped group IV semiconductors. The contributed talks cover a myriad of disparate systems that range from Mn-doped CdSe quantum dots to transition-metal doped Ga2Se3 to various oxide-based magnetic semiconductors.

The last oral session, on Friday morning, covers spin injection, spin transfer and spin-dependent tunneling in systems ranging from novel organic to oxide systems. There are three invited talks in this session to cover each of the three topics. These studies illustrate potential new materials for device applications.

CODE		SESSION
MI-WeM		Magnetic Thin Films and Nanostructures S.J. Jenkins, University of Cambridge, UK M.-T. Lin, National Taiwan University
MI-WeA		Nanomagnetic Imaging and Spectroscopy Y. Acremann, PULSE Ctr., Stanford Synchrotron Radiation Laboratory K. Kern, Max-Planck-Institut für Fest- körperforschung, Germany
MI-ThM		Magnetic Semiconductors I A.H. MacDonald, Univ. of Texas at Austin
MI-ThA		Magnetic Semiconductors II Z. Zhang, Oak Ridge National Laboratory and University of Tennessee
MI-FrM		Spin Injection, Transfer, and Tunneling M.E. Flatté, The University of Iowa P. LeClair, University of Alabama S.E. Russek, NIST

Manufacturing Science and Technology
In the 21st century, manufacturing will continue to drive a sizeable percentage of the world’s gross national product and will provide the bridge for spanning fundamental sciences and commercial production of the high technology products. The MSTG is continuing to expand its efforts to include all areas of nano-manufacturing while main-taining its core competence in semiconductor manufacturing. As part of the 54th International Symposium of AVS, the focus for the Manufacturing Science and Technology Group will be to explore nano-manufacturing research areas across a broad spectrum of the high technology industries. The MSTG will co-sponsor a Topical Conference on Nano-manufacturing which will hold an all invited session covering the critical topic of “Beyond CMOS–new manufacturing approaches for “nano” information technology.” We will hold two sessions. The first session, Metrology and Characterization for Manufacturing, will be held Thursday morning. It features two invited presentations covering new materials characterization methods which are moving toward routine applicability for manufacturing. These are atom probe and He ion microscopy. The second session is on MEMS and NEMS Manufacturing. The two invited talks cover the important area of the role of silicon semiconductor manufacturing facilities in MEMS manufacturing.

CODE		SESSION
MS-TuA		Metrology and Characterization for Manufacturing T. Kelly, Imago Scientific Instruments J. Notte, ALIS Corporation (Carl Zeiss SMT)
MS-ThA		MEMS Manufacturing J.D. Evans, Defense Advanced Research Projects Agency (DARPA) G.D. Winterton, Texas Instruments Inc.

MEMS and NEMS
The MEMS and NEMS Program will highlight recent advances in the development of functional, integrated micro and nanoelectromechanical devices. This year’s session will cover areas that are thematically related to the materials processing and characterization, fabrication approaches, surface and interface sciences of MEMS and NEMS, and integration and packaging strategies of MEMS and NEMS. Applications of MEMS and NEMS devices in resonant sensing of chemical and biological immunospecific binding events, study of parametric dynamical phenomenon of coupled oscillator systems, electronics and dissipation mechanisms are also addressed.

MEMS and NEMS will host three primary oral sessions and one poster session followed by various joint sessions. The program opens with an invited talk by S. Pacheco with the emphasis on the challenges of materials processing, characterization and novel approaches to the fabrication of RF-MEMS resonators followed by contributed presentations discussing recent progress in the development of RF-MEMS resonators based on various candidate materials such as AlN, diamond and carbon nanotube including studies on dissipation mechanism in resonators. Apart from these, some interesting studies on the characterization of material transfer during nanoscale switching action will also be addressed. The same session also features two invited talks by P. McEuen and A. Edelstein discussing issues in MEMS processing and fabrication of MEMS magnetometer respectively. The highlight of the second session will be an invited talk by Amit Lal on the challenges of Integration and Packaging in MEMS/NEMS. Contributing presentations discussing latest developments of the unique dynamics that underpin these widely disparate integration and packaging endeavors include integration of diamond with CMOS, fluidic and optically interrogated mechanical structures. These efforts are crucial and open new avenues for observing, probing and controlling micro and nanoscale structures with sufficient regularity and precision. The poster session includes general materials and device aspects of MEMS and NEMS.

Joint session with tribology program (TR) focused on the impact of surfaces and interfaces on MEMS and NEMS device characteristics. The session is highlighted with invited talks by Jackie Krim and Roya Maboudian. In this session, the invited lectures discuss operation of MEMS and NEMS in harsh environments including low pressures, high and cryogenic temperatures, and high relative humidity con-ditions. Tribological issues and possible solutions for operation of MEMS in such extreme environments are also discussed. These effects are critical to progress in the development of functional MEMS and NEMS based sensors and actuators.

Division Sponsors
INPHOT, INC.
CODE		SESSION
MN-MoM		Materials Processing, Characterization and Fabrication Aspects S.P. Pacheco, Freescale Semiconductor, Inc.
MN-MoA		Materials Processing, Characterization & Fab Aspects A.S. Edelstein, U.S. Army Research Lab. P.L. McEuen, Cornell University
MN-TuM		Integration and Packaging in MEMS/NEMS A. Lal, DARPA
MN-TuP		MEMS and NEMS Poster Session

Nanometer-Scale Science and Technology
The Nanometer-scale Science and Technology Division Program for 2007 covers recent advances in nanoimaging, nanotribology, nanoassembly, nanolithography, nanotechnology, nanotubes, and nanowires. Applications of nanostructures and devices in electronics, photonics, sensing, and nanobiotechnology are also addressed. A major focus in nanoscale science and technology is high-resolution imaging and high sensitivity detection using scanning probes. We have invited an excellent group of experts as invited speakers (listed below) to highlight the related activities in 10 of the Nanometer-scale Science and Technology Oral sessions.

The division also co-sponsors a special program in Nanotribology and Nanomechanics with 2 outstanding invited speakers. Our activities also cross over other AVS divisions and we have joint programs within Nanoelectronic and Nanophotonic Devices, Fabrication and Characterization of Functional Soft Material Surfaces, Surface Analysis for Biological Materials, Understanding Surface Functionalized Nanoscale Materials, Nano-Engineering of Biointerfaces, and Plasmas in Nanotechnology. The Nanometer-scale Science and Technology Division is also pleased to host the 2007 AVS Albert Nerken Award winner, Rich Colton from Naval Research Laboratory, who will lecture on Surface Analysis and Nanotechnology: A Personal Odyssey.

CODE		SESSION
NS-MoM		Nanoscale Assembly and Manipulation I H. Wolf, IBM Research GmbH, Zurich Research Laboratory, Switzerland
NS-MoA		Nanoscale Assembly and Manipulation II M.L. Culpepper, MIT
NS-TuM		Imaging of Nanostructures D.S. Ginger, University of Washington R.F. Klie, University of Illinois - Chicago
NS+MS-TuA		Characterization of Nanostructures N.P. Economou, Carl Zeiss SMT S. Hasegawa, University of Tokyo, Japan
NS-TuP		Nanometer-scale Science and Technology Poster Session I
NS+EM-WeM		Nanoscale Devices and Nanowires I D.K. Ferry, Arizona State University F.M. Ross, IBM T. J. Watson Research Center
NS1+BI-WeA		Biological and Molecular Applications of Nanoscale Structures V. Vogel, ETH Zürich, Switzerland
NS2+EM-WeA		Nanoscale Devices and Nanowires II A. Fujimoto, Toshiba Corporation, Japan
NS-ThM		Nanotube Devices and Processes
NS-ThA		Nanoscale Sensors R.J. Colton, Naval Research Laboratory* M. Hegner, CRANN, Univ. of Dublin, Ireland
NS-ThP		Nanometer-Scale Science & Techology Poster Session II
NS-FrM		Nanolithography and Nanoprocess Technology J. Brugger, Swiss Federal Institute of Technology (EPFL), Switzerland M.Y. Simmons, U. of New South Wales, Australia

Plasma Science and Technology
The Plasma Science and Technology area will highlight a spectrum of recent and exciting advances in plasma research, ranging from semiconductor related processing to bioscience and nanotechnology applications, from diagnostics for studying gas phase and surfaces to novel plasma sources. The complete program includes sixteen oral sessions and two posters sessions covering semiconductor, low-k and high-k dielectric etching, plasmas for applications in nanoscience and nanotechnology, plasma deposition, plasma-wall interactions, plasma sources, plasma diagnostics, and plasma-surface interactions in etching and deposition. An overall program highlight is the Tuesday morning session on plasma enhanced atomic-layer deposition (PEALD) and plasma enhanced chemical vapor deposition (PECVD). This joint session with the Thin Film Division will feature three invited speakers, including the 2007 Peter Mark Award recipient, Professor Erwin Kessels, and Professors Jeon and Massines who will talk about PEALD, PECVD of high-k dielectrics and atmospheric pressure plasma deposition of silicon, respectively.

The Plasma Science and Technology Program begins on Monday morning with two sessions on advanced interconnect etching and plasma modeling. A highlight of the morning sessions is the invited presentation by Professor T. Makabe of the Keio University, who received the Plasma Science and Technology Division Plasma Prize in 2006. Following the theme of Prof. Makabe’s research of modeling at multiple length and time scales, several presentations will focus on plasma gas phase modeling and profile simulations. The Advanced Interconnect Etching Session is co-sponsored by the Manufacturing Science and Technology Division and will feature two invited talks by Dr. Nozawa and Professor Neureuther who will present on challenges in low-k dielectric etching and on design-process integration.

Monday afternoon’s stand-alone session will begin with the John A. Thornton Memorial Award Lecture; this year's recipient, Professor Steve Pearton, will talk about etching wide-band gap semiconductors such as SiC and ZnO. The papers following will concentrate on etching III-V semiconductors, high-k dielectrics and other materials that are encountered in novel devices and gates.

The program for Tuesday starts with two parallel oral sessions. The first session is on gate etching where Th. Lill will present an invited talk on integration challenges in gate patterning. The session provides a snapshot of the state of the art and issues related to patterning sub-45 nm gates. This session is in parallel with the session on plasma enhanced atomic-layer deposition (PEALD) and plasma enhanced chemical vapor deposition (PECVD).

The second of two sessions on advanced interconnect etching is on Tuesday afternoon in parallel with a session that will concentrate on plasma sources where Pascal Chabert will deliver an invited talk on fundamentals of electron heating mechanism and mode transitions in dual-frequency plasma sources.

Wednesday will open with a jointly sponsored session (with the Nanometer-Scale Science and Technology Division) on the growing area of plasma applications in nanotechnology. The highlight of the plasma deposition session will be Professor Hatakeyama’s invited presentation on synthesis of carbon nanotubes through ionic plasmas. The first of the three plasma-surface interactions sessions is also on Wednesday morning. This first session will focus on fundamentals of plasma-surface interactions with emphasis on ion-surface interactions and UV-VUV damage. The highlight of this session is an invited talk by Professor M. Gordon who will talk about interactions of F-containing ions with semiconductor, dielectric and metal surfaces.

One of the two parallel sessions on Wednesday afternoon will focus on plasma-wall interactions. Dr. Singh of Lam Research will present an invited talk on diagnostics designed to elucidate plasma-wall interactions during etching and chamber cleaning. The second session is on plasmas and polymers and includes papers ranging from plasma-photoresist interactions to plasma deposition and etching of polymer films. Dr. Erwine Pargon will give an invited talk in this session on the impact of plasma etching process on 193 nm photoresist.

The first of two sessions on plasma diagnostics will start the day on Thursday in parallel with a second session on plasma-surface interactions. The highlight of the session on plasma diagnostics is an invited talk by Dr. J. Benedikt on measurements of the absolute density of growth precursors in plasma deposition through mass spectrometry. The session on plasma-surface interactions also includes papers on ion-surface interactions and their quantification for use in profile simulations. Dr. M. Sobolewski of the National Institute of Standards and Technology will give an invited talk on noninvasive monitoring of ion current and energy during plasma processing.

The joint session between PSTD and Biomaterial Interfaces Division on plasmas in bioscience will be on Thursday afternoon in parallel with the second session on plasma diagnostics. Dr. I. Yamashita of the Matshushita Electric Industrial will give an invited talk on a new approach to nano-fabrication of functional structures in the joint session with the Biomaterial Interfaces Division. T. Gans will conclude the day with an invited talk on process control through diagnostics in multifrequency discharges and atmospheric plasmas. Do not buy your plane tickets until Friday afternoon because the third session on plasma-surface interactions on Friday morning has papers from leading groups, including contributions from Professors Graves, Kushner, Oehrlein, and Sawin. This session will concentrate on the very important issue of plasma-surface interactions relevant to degradation and roughening of photoresist below the 0.45 nm node, a potential show stopper.

CODE		SESSION
PS1-MoM		Plasma Modeling T. Makabe, Keio University, Japan
PS2-MoM		Plasma Etching for Advanced Interconnects I A. Neureuther, Univ., of California, Berkeley T. Nozawa, Tokyo Electron LTD Japan
PS-MoA		Processing for High k, III-V and Smart Materials S.J. Pearton, University of Florida*
PS1+TF-TuM		Plasma Enhanced Atomic Layer Deposition and Plasma Deposition H. Jeon, Hanyang University, South Korea W.M.M. Kessels, Eindhoven University of Technology, The Netherlands* F. Massines, CNRS PROMES, France
PS2-TuM		Advanced Gate Etch Th. Lill, Applied Materials, Inc.
PS1-TuA		Plasma Etching for Advanced Interconnects II
PS2-TuA		Plasma Sources P. Chabert, École Polytechnique, France
PS-TuP		Plasma Science and Technology Poster Session
PS1+NS-WeM		Plasmas in Nanotechnology R. Hatakeyama, Tohoku University, Japan
PS2-WeM		Plasma-Surface Interactions I M.J. Gordon, California Inst. of Technology
PS1-WeA		Plasma-Wall Interactions H. Singh, Lam Research Corporation
PS2-WeA		Plasmas and Polymers E. Pargon, CNRS, France
PS1-ThM		Plasma-Surface Interactions II J. Benedikt, Ruhr-Univ. Bochum, Germany
PS2-ThM		Plasma Diagnostics I M.A. Sobolewski, NIST
PS1-ThA		Plasma Diagnostics II T. Gans, Queen’s University Belfast, UK
PS2+BI-ThA		Plasmas in Bioscience I. Yamashita, Matsuhita Electric Industrial Co. Ltd. Japan
PS-ThP		Plasma Science and Technology Poster Session
PS-FrM		Plasma-Surface Interactions III

Surface Science
The Surface Science program encompasses fundamental research, new techniques, and forefront analytical studies involving solid surfaces and interfaces. This interdisciplinary research area includes the development and application of state-of-the-art experimental or theoretical techniques to elucidate scientific concepts underpinning chemical and physical phenomena at surfaces or interfaces. This understanding provides the foundation for studies of technologically relevant materials.

This year’s program includes sessions addressing such fundamental surface science topics as: (i) catalysis on clusters and nanoparticles, (ii) surface structure, growth and etching of Si and Ge, (iii) water at solid surfaces, (iv) electronic and vibrational structure of surfaces, (v) catalytic chemistry of hydrocarbons, (vi) surface structure and growth on metals, (vii) bimetallics and alloys, (viii) excitations at surfaces, (ix) oxide surface reactivity, (x) SAMs and organic films (co-sponsored with EMPD and TFD), (xi) reactions on metal surfaces, (xii) oxide surface structure, (xiii) surface structure of compound semiconductors (co-sponsored with EMPD), (xiv) environmental surfaces (co-sponsored with ASSD), (xv) organic and carbon films on Si (co-sponsored with EMPD and TFD), and (xvi) surface dynamics. Additionally, the Surface Science Division has two sessions included in the Industrial Physics Forum 2007: The Energy Challenge titled “Catalysis for hydrogen storage and the hydrogen economy” and “Surface science challenges for solar energy conversion” (co-sponsored with TFD). Finally, the traditional Surface Science Post-Deadline Discovery Session will be held on Thursday evening, at which time the Morton S. Traum Award Winner will be announced.

CODE		SESSION
SS1-MoM		Catalysis on Clusters and Nanoparticles M. Bowker, Cardiff University, UK
SS2-MoM		Structure, Growth, and Etching of Silicon and Germanium
SS1-MoA		Water-Surface Interactions G. Held, University of Reading, UK
SS2-MoA		Electronic and Vibrational Structure H. Ueba, The University of Toyama, Japan
SS1-TuM		Catalytic Chemistry of Hydrocarbons M. Mavrikakis, Univ. of Wisconsin, Madison
SS2-TuM		Surface Structure and Growth on Metals H.H. Weitering, University of Tennessee
SS1-TuA		Bimetallics and Alloys J.G. Chen, University of Delaware
SS2-TuA		Excitations at Surfaces L. Sanche, Univ. of Sherbrooke, Canada
SS-TuP		Surface Science Poster Session
EN+SS+TF-WeM		Catalysis for Hydrogen Storage and the Hydrogen Economy L. Schmidt, University of Minnesota
SS1-WeM		Oxide Surface Reactivity F.P. Netzer, Karl-Franzens U. Graz, Austria
SS2+EM+TF-WeM		SAMs and Organic Films I
SS1-WeA		Reactions on Metal Surfaces T. Matsushima, Hokkaido University, Japan
SS2-WeA		Oxide Surface Structure I M. Reichling, Universität Osnabrück, Germany
EN+TF+SS-WeA		Photovoltaics, Fuel Cells, and Alternative Energy Materials and Applications Y. Yang, University of California, Los Angeles
SS1-ThM		Oxide Surface Structure II S.A. Chambers, Pacific Northwest Natl Lab.
SS2-ThM		Surface Structure of Compound Semiconductors V.M. Bermudez, Naval Research Laboratory
EN+SS+TF-ThM		Surface Science Challenges for Solar Energy Conversion N.S. Lewis, California Institute of Technology
SS1-ThA		Environmental Surfaces H. Fairbrother, Johns Hopkins University
SS2+EM+TF-ThA		Organics and Carbon Films on Silicon J.M. Buriak, University of Alberta, Canada
SS-ThP		Surface Science Poster Session
SS1-FrM		Surface Dynamics J.I. Pascual, Freie Universität Berlin, Germany
SS2+EM+TF-FrM		Organic Films II: Semiconductors and C60 G.-Y. Liu, University of California, Davis

Thin Film
This year’s Thin Film Division Program will highlight the growing field of Atomic Layer Deposition (ALD) with 4 full sessions (including a joint session with Plasma Science) focusing on applications, emerging topics, surface chemistry and plasma ALD. The ALD and Applications Session will include invited lectures by W.L. Gladfelter (University of Minnisota) highlighting a combinatorial ALD process and K.K Gleason elaborating on a conformal polymer ALD process. The Emerging Topics in ALD Session will be highlighted by an invited lecture by M. Knez (Max-Planck-Institute of Microstructure Physics, Germany) that will discuss how ALD is making in-roads to nano(Bio)technology. In the third session entitled Surface Chemistry for Atomic Layer Deposition, J.F. Sanz (Universidad de Sevilla, Spain) will present an invited lecture on Simulations of the Surface Chemistry of HfO2 ALD. Finally, there will be a joint session with the Plasma Science Division on Plasma ALD featuring invited talks from H. Jeon (Hanyang University, South Korea) and the Peter Mark Memorial Award Lecture by W.M.M. Kessels (Eindhoven University of Technology, The Netherlands). Contributed papers will cover broad areas of oxide and metallic thin films, low-k materials, controlled doping, ALD device fabrication, and novel polymer growth.

The Photovoltaics, Fuel Cells, and Alternative Energy Materials and Applications will have two sessions on a variety of materials and devices and thin film synthesis techniques for advanced energy applications. An invited lecture by Y. Yang (University of California, Los Angeles) will discuss the Plastic Bulk-Heterojunction Solar Cells and Near-Infrared Photodetectors.

The Growth, Characterization, and Modeling of Thin Films sessions will be highlighted by invited lectures by J.G. Amar (University of Toledo) on the Effects of Steering and Shadowing in Epitaxial Growth, T. Karabacak (University of Arkansas at Little Rock) discussing the Growth dynamics of nanostructures and thin films, Susan Sinnott (University of Florida) in the Computational Aspects of Thin Films session, and Q. Li (Penn State) overviewing his recent work on MgB2 superconductive thin films. True to the session name, contributed papers will cover a broad gamut of topics covering the growth, characterization, and modeling of thin films.

The Thin Films for Displays and Flexible Electronics session covers a variety of topics including transparent transistors and conducting oxides, to some photonic crystal devices and permeation layers. The session is highlighted by and invited talk by D.C. Paine (Brown University) who will discuss the Fabrication and Characterization of Indium Zinc Oxide-Based Thin Film Transistors. The Carbon Nanomaterials Session will have a focus on two-dimensional carbon nanostructures including an invited talk by Walt de Heer (Georgia Tech) on graphene FETs. The Thin Films Poster Sessions held on Tuesday and Thursday evenings will present a diverse range of topics covering thin film growth fundamentals and techniques, characterization and analysis, and device applications.

In addition to these sessions, the Thin Film Division also co-sponsors the following sessions (co-sponsoring division): Nano-Manufacturing of Materials (Nanomanufacturing), Plasma Enhanced Atomic Layer Deposition and Plasma Deposition (Plasma Science), Surface Science Challenges for Solar Energy Conversion (Surface Science), and Organic Film Growth (Surface Science).

CODE		SESSION
TF-MoM		Atomic Layer Deposition and Applications W.L. Gladfelter, University of Minnesota K.K. Gleason, MIT
TF-MoA		Emerging Topics in Atomic Layer Deposition M. Knez, Max-Planck-Institute of Microstructure Physics, Germany
TF-TuM		Two-Dimensional Carbon Nanostructures W.A. de Heer, Georgia Inst. of Technology
TF-TuA		Surface Chemistry for Atomic Layer Deposition C.B. Musgrave, Stanford University
TF-TuP		Aspects of Thin Films Poster Session
TF-WeM		Thin Film and Nanoparticle Growth and Characterization R.E. Palmer, The Univ. of Birmingham, UK
EN+SS+TF-WeM		Catalysis for Hydrogen Storage and the Hydrogen Economy L. Schmidt, University of Minnesota
EN+TF+SS-WeA		Photovoltaics, Fuel Cells, and Alternative Energy Materials and Applications Y. Yang, Univ. of California, Los Angeles
TF-WeA		Oblique Angle Deposition J.G. Amar, University of Toledo T. Karabacak, U. of Arkansas at Little Rock
EN+SS+TF-ThM		Surface Science Challenges for Solar Energy Conversion N.S. Lewis, California Inst. of Technology
TF-ThM		Thin Films for Electronic Applications Q. Li, Pennsylvania State University
TF1-ThA		Photovoltaics, Fuel Cells, and Alternative Energy Materials and Applications
T2-ThA		Computational Aspects of Thin Films S.B. Sinnott, University of Florida
TF-ThP		Aspects of Thin Films Poster Session
TF-FrM		Thin Films for Displays and Flexible Electronics D.C. Paine, Brown University
TF2-FrM		Nanoparticles M.G. White, Brookhaven National Lab.

Vacuum Technology
The 2007 Vacuum Technology Division Program offers traditional and new topics. Our session on large vacuum systems spans the gamut from space simulation to industrial need to understand vacuum gas dynamics for system design. We discuss the need for miniature and portable vacuum systems for terrestrial and space applications in session VT WeA. Miniaturization and portability requirements are driven by industrial and homeland security considerations. Our VT ThM session addresses pumping, pressure measurement and calibration topics. VT ThA explores exciting developments in outgassing phenomena as well as large vacuum systems, including space simulation. Our poster session Thursday at 5:30 p.m. includes a number of student posters which are in competition for a $500 cash prize. We will again hold our Ask The Experts event, where we offer the expertise of vacuum technologists to answer questions about all aspects of vacuum technology, in the exhibit area. All attendees are welcome to ask any vacuum questions, from basic principles to processing questions. ATE will be open all the hours of the exhibit.

CODE		SESSION
VT-WeA		Miniature, Portable and Space Vacuum Applications R.J. Kline-Schoder, Creare Incorporated S. Semancik, NIST P.W. Valek, Southwest Research Institute
VT-ThM		Pumping, Pressure Measurement and Calibration A.D. Chew, BOC Edwards, UK
VT1-ThA		Adsorption/Desorption Phenomena on Vacuum Materials M. Leisch, Graz Univ. of Technology, Austria
VT2-ThA		Large Vacuum Systems F.G. Collins, The U. of Tennessee Space Institute
VT-ThP		Vacuum Technology Poster Session

TOPICAL CONFERENCES/SPECIAL SESSIONS

American Institute of Physics Industrial Physics Forum 2007 (IPF): The Energy  Challenge
The Corporate Associates of the American Institute of Physics (AIP) host the Industrial Physics Forum (IPF)—a multifaceted science meeting that presents industrial, academic and governmental views and addresses significant issues in physics and related fields. The IPF brings together industry executives, academics, research managers, and science policy decision makers for discussions and up-to-date assessments of the current research and policy developments that affect the physical sciences community. The IPF fosters the sharing of knowledge, collaboration, and enables the exchange of ideas with other R&D leaders who face similar research and business challenges. This is the second consecutive IPF held in conjunction with the AVS International Symposium. This unique gathering affords participating attendees an experience of information exchange in focused areas and fields complimentary to AVS’s diverse science and te