Technical Program                 

The AVS 58th International Symposium and Exhibition will be held at the Nashville Convention Center in Nashville, TN, October 30 through November 4, 2011. Once again our technical program is second to none, providing cutting-edge content over a very broad range of diverse yet complementary topics. Brief summaries of each program theme are provided below, with the full schedule of oral and poster presentations following them. Note the amazing list of distinguished invited speakers in each program. They represent the best and the brightest work from around the world, from industrial, academic, and governmental research labs. Peruse the whole technical program, over 1300 papers presented in over 145 oral and poster sessions, and start filling your week’s schedule with must-see, career enhancing sessions. Do not forget to stop by the Exhibitors & Manufacturers Technology Spotlight Sessions during the in the technical session breaks. They will be held in the Exhibit area. Stop by and see twenty minute presentations given by representatives from several of our exhibitors. They will be introducing new products, demonstrating capabilities, discussing applications, and more.



The Advanced Surface Engineering Division (SE) focuses its interest on new materials, technologies, characterization, manufacturing, applications, and fundamentals of surface engineering and coating technologies. The SE oral sessions at AVS 58 cover Glancing Angle Deposition, Surface Engineering for Thermal Management, Atmospheric Pressure Plasmas and Treatments, Nanostructured Thin Films and Coatings as well as Pulsed Plasmas and HIPIMS/HPPMS. These sessions provide a balance between fundamental understanding and applications of these topics. The presentations cover novel coating materials, processes, design and modeling, diagnostic and growth control, structural, chemical, and mechanical characterizations, wear and corrosion protection, oxidation resistance and thermal stability and other aspects related to surface engineering and coatings.

This year’s program features several invited and numerous contributed talks as well as contributions to the poster session on Tuesday evening. Our program starts on Tuesday afternoon with a joint session with the Thin Film’s Division on “Glancing Angle Deposition.” It opens with an invited lecture by Gwo-Ching Wang from Rensselaer Polytechnic Institute on the “Evolution of Crystal Orientation during Oblique Angle Deposition”. In Wednesday morning’s session on “Surface Engineering for Thermal Management”, Gang Chen from MIT presents and invited lecture on “Near-Field Radiation Heat Transfer”. The afternoon session is devoted to Atmospheric Pressure Plasmas with Michael Kong from Longborough University in the UK being invited to speak on “Cold Atmospheric Plasma Sources for Treatment of Cell-Containing Surfaces”. Our session on Hard and Nanostructured Coatings on Thursday morning will feature an invited talk by Sam Zhang from Nanyang Technological University in Singapore entitled “Tensile Testing of Substrates for Fracture Toughness of Thin Films”. The afternoon session deals with Pulsed Plasmas in Surface Engineering, starting with the invited talk of Jaroslav Vlček from Plzen, Czech Republic on “Pulsed Magnetron Sputtering Systems for Reactive Deposition of Oxide and Nitride Films”. In addition to these topics, the Advanced Surface Engineering Division cosponsors additional sessions with the divisions Thin Films, Surface Science and Plasma Science and Technology.

Session Code

Session Title


GLAD II Glancing Angle Deposition II
Gwo-Ching Wang, Rensselaer Polytechnic Inst


Advanced Surface Engineering Poster Session


Surface Engineering for Thermal Management
Gang Chen, MIT
SE+PS-WeA Atmospheric Pressure Plasmas
Michael Kong, Loughborough University, UK
SE-ThM Nanostructured Thin Films and Coatings
Sam Zhang, Nanyang Technological U., Singapore
SE+PS-ThA Pulsed Plasmas in Surface Engineering
Jaroslav Vlcek, U. of W. Bohemia, Czech Republic



The use of applied surface science to understand interfacial and surface properties is essential in order to solve materials challenges in the fields of energy, semiconductor processing, nanoscience and biotechnology as well as fundamental research. ASSD is delighted to have a packed program featuring core topics to our members as well as co and are co-sponsoring excellent focus topics on spectroscopic ellipsometry, helium ion micro-
scopy, in situ microscopy and transparent conductors. We are also delighted to give joint sessions that focus on techniques for biointerface and biomaterials analysis, characterization and imaging at the nanoscale including the use of scanning probes, and in situ analysis of film growth. We start the week focusing on developments in quantitative chemical analysis and technique development. Sven Tougaard begins the day with an invited paper on recent developments in characterizing and 3D imaging of nanostructures using XPS. Ralf Richter will give an invited talk discussing the use of characterization methods in biology in particular structure-function relationships. On Tuesday we move on to discussion of advances in imaging and 3D chemical analysis. Toshio Miyayama will give an invited presentation on characterizing organic electronics using a recently introduced gas cluster ion beam (GCIB) SIMS source and then Wilfried Vandervorst will discuss advances in probing 3D semiconductor structures. Tuesday night is our popular poster session. On Wednesday, we focus on scanning probe microscopy with Toshio Ando and Christopher Yip giving invited presentations on exciting developments in atomic force microscopy. In the afternoon, our session highlights the importance of correlative analysis and a multi-technique approach for chemical characterization and the determination of structure-function relationships. Kathryn Lloyd will describe the important challenges in combining data from multiple techniques. On Wednesday, we will also have a parallel joint session with Biomaterials focusing on the analysis and functionalization of nanostructures where Emile Schweikert presents fundamental studies of characterizing nano-objects using cluster SIMS. We end the week focusing on the analysis of challenging samples. D. Baer will give an invited talk on approaches to sample preparation and analysis of samples ranging from nanostructures to catalysts to biological samples. We look forward to seeing you in Nashville!

Session Code

Session Title
AS-MoM Quantitative Surface Chemical Analysis and
Technique Development – Part I
Sven Tougaard, U of Southern Denmark
AS-MoA Quantitative Surface Chemical Analysis and
Technique Development – Part II
Ralf Richter, CIC biomaGUNE & MPI for
Intelligent Systems, Spain
AS-TuM  Imaging and 3D Chemical Analysis
Takuya Miyayama, ULVAC-PHI Inc., Japan
AS-TuA Imaging and 3D Chemical Analysis – Part II
Wilfried Vandervorst, IMEC, Belgium
AS-TuP Applied Surface Science Poster Session
AS+BI+NS-WeM Advances in Scanning Probe Microscopy
Toshio Ando, Kanazawa University, Japan
Christopher Yip, University of Toronto, Canada
AS-WeA Correlative Analysis - A Multi-technique Approach for Identification and Structure-Property Relationships
Kathryn Lloyd, DuPont Corp Ctr for Analytical Sciences
AS-ThM  Analysis of Insulators and Challenging Samples
Don Baer, Pacific Northwest National Lab


In the tradition of the Biomaterial Interfaces Division (BID), a broad technical program has been established that is focused on progress in biointerface science and engineering and brings together an interdisciplinary group of experts that work at the intersection of biosurface and interface science, the nanosciences, and biomedical engineering.

The BID technical program for the week incorporates classical topics such as “Cells at Interfaces” (including stem cells and bacteria), “Biomolecules at Interfaces” (e.g. protein, peptide, DNA and sugar interactions with surfaces), “Characterization of Biomedical Materials” and “Sensors and Fluidics for Biomedical Applications”. These sessions are designed to appeal to the core of the Biomaterials Interface Division and bring it back to some of the key strengths that have appealed to our members, while also including some new ways of looking at these classic BI topics. Additionally, the BI division is sponsoring a new focus session on “Biofabrication and Novel Devices”. Joint sessions with other AVS divisions such as the Applied Surface Science Division (AS) and Plasma Science Division (PS) explore other areas of surface analysis such as “Advances in Scanning Probe Microscopy and Quantitative Chemical Analysis of Soft Materials and Biomaterials”.

The annual BID sessions will commence on Sunday afternoon with the annual Biomaterials Plenary (BP) session. This year we are joining up our Plenary Session with the Applied Surface Science (AS) division with the theme “Challenges in Biomaterials Analysis”. Talks address current needs and issues in biomedical surface analysis and translation, traditional strengths of the BID division. The event will close with the opportunity for further discussions at our traditional industry sponsored Plenary Reception.

Session Code

Session Title
BP-SuA Challenges in Biomaterials Analysis
David Castner, University of Washington
Yves Dufrene, U Catholique de Louvain, Belgium
Buddy Ratner, U of Washington Engineered Biomatls
Alexander Shard, National Physical Lab, UK
BI-MoM Biomolecules at Interfaces
Rein Uljin, The University of Strathclyde, UK
BI-MoA Sensors and Fluidics for Biomedical Applications
Jennifer Shumaker-Perry, University of Utah
BI-TuA Protein-Membrane Interactions
Matthias Lösche, Carnegie Mellon U and NIST
BI-WeM Cells at Interfaces
Pieter Dorrestein, Univ of California, San Diego
Todd McDevitt, Georgia Institute of Technology
BI+AS+NS+SS-WeA Functionalization and Characterization of Nanostructures
Holger Schönherr, Univ of Siegen, Germany
Emile Schweikert, Texas A&M University
BI-ThM Biomedical Materials
Erika Johnston, Genzyme
Lawrence Salvati, DePuy Orthopaedics
BI-ThP Biomaterial Interfaces Poster Session


The Electronic Materials and Processing Division (EM) will sponsor nine oral sessions containing over 60 talks and a poster session on electronic materials synthesis, processing, characterization, and structure-property relationships. Inorganic and organic electronic and optical materials will be covered as well as hybrid devices and interfaces. Six sessions are devoted to high-k, low-k, and memory dielectrics and defects in materials. Highlights include papers by Marc Heyns (IMEC) on high mobility channel materials and novel devices for scaling electronic devices beyond the Si roadmap, by Kang Wang (UCLA) on oxides for spintronics, by Mihaela Balseanu (AMAT) on BN for sub-20 nm devices, by Minghwei Hong (NTHU/NTU) on III-V and Ge MOSFETs, by Alfred Grill (IBM) on the development and process integration of ultralow-k dielectrics, and by E. Zhang (Vanderbilt) on X-ray induced defect formation in graphene. A session on “Surfaces and Materials for Next-Generation Electronics” will be led by Jack Rowe’s (NC State) Albert Nerken Award Lecture on electron spectroscopy of semiconductor surfaces and will wrap up with invited talks on topological insulators, GaN, and graphene. There will be talks on group III nitrides, organic photovoltaics, conducting polymers, conductive coatings on textiles, and quantum dot processing and devices. Other sessions will focus on hybrid organic/inorganic materials and self-assembled monolayers for activating and deactivating surfaces. A poster session containing over 20 papers will be held in conjunction with the oral sessions. EMPD will also cosponsor sessions with TFD, PSTD, NSTD, and SSD as well as separate focus topics on Transparent Conductors and Printable Electronics, Energy Frontiers, and Graphene.

Session Code

Session Title
EM-MoM Dielectrics for Novel Devices and Process Integration
Mihaela Balseanu, Applied Materials, Inc.
Tetsuo Endoh, Tohoku University, Japan
Alan Seabaugh, University of Notre Dame
DoYeung Yoon, Seoul National Univ, Korea
EM1-MoA Group III-Nitrides and Hybrid Devices
EM2-MoA Dielectrics for Ultra Dense Memory Devices
Cheol Seong Hwang, Seoul Natl Univ, Korea
Derchang Kau, Intel Corporation
Gabriel Molas, CEA Leti Minatec Campus, France
Kang Wang, Univ of California Los Angeles
EM+TF-TuM High-k Dielectrics for MOSFETs Part 1
Minghwei Hong, Natl Tsing Hua Univ, Taiwan
Eric Vogel, University of Texas at Dallas
EM-TuA High-k Dielectrics for MOSFETs Part 2
Marc Heyns, IMEC, Belgium
Paul McIntyre, Stanford University
EM-WeM Low-k Materials and Devices
Reinhold Dauskardt, Stanford University
Alfred Grill, IBM Research
EM-WeA Defects in Electronic Materials
Leonard Brillson, The Ohio State Univ.
EM+TF-ThM Hybrid Electronic Materials and Interfaces
Seongil Im, Yonsei University, Korea
W. Grant McGimpsey, Kent State University
EM-ThP Electronic Materials and Processing Poster Session
EM+SS-FrM Surfaces and Materials for Next Generation Electronics
M. Zahid Hasan, Princeton University
Tomas Palacios, MIT
Jack Rowe, North Carolina State University*


The 2011 Magnetic Interfaces and Nanostructures program features pioneering invited and contributed talks from William Butler and Greg Szulczewski, that both review and recommend solutions to long standing barriers in enhancing fundamental magnetic properties and interfacial spin polarized carrier transport/injection. Of significant interest, Markus Donath will present the first spin-resolved measurements of the Rashba-split surface state of Au(111), and Claudia Felser, the significant and controversial, diversity and wealth, the Heusler intermetallics bring in controlling both the surface and bulk spin polarized electronic structure. Rounding out the program is a contributed talk from Ohio University concerning the spin-polarized carrier interaction with Molecular Machines as well as an invited talk from Hermann Durr, who will review the state-of-the-art in ultra fast magnet spectroscopies capable of resolving real time magnetization dynamics on the hundreds of femptosecond scale.

Session Code

Session Title
MI-WeM Fundamental Problems in Magnetism
William Butler, The University of Alabama
Claudia Felser, Johannes Gutenberg University Mainz, Germany
Elio Vescovo, Brookhaven National Laboratory
MI-WeA Spintronics, Magnetoelectronics, Multiferroics, and Dilute Magnetic Semiconductor Applications
Kirill Belashchenko, Univ of Nebraska-Lincoln
Mairbek Chshiev, SPINTEC, UMR 8191 CEA/CNRS/UJF Grenoble, France
Qi-Kun Xue, Tsinghua University, China
MI-ThM Emerging Magnetic Characterization and Results
Hermann Durr, SLAC National Accelerator Lab
T. Zac Ward, Oak Ridge National Laboratory
MI-ThP Magnetic Interfaces and Nanostructures Poster Session


This year, the Manufacturing Science and Technology Group concentrated on manufacturing challenges facing “beyond CMOS” devices based on graphene and co-sponsored sessions on spectroscopic ellipsometry and in vacuum technology. Over the past year, the semiconductor industry continues to work with academia and the national laboratories and NIST to advance graphene nanoelectronics. A number of transistor devices have been fabricated and simple circuits have been fabricated across SiC wafers. One of the strengths of the AVS in the interplay between research and industry is again demonstrated at the national symposium in the all invited session: “Low Dimensional Carbon Device Manufacturing”. This session covers the fabrication of large area graphene with materials properties suitable for circuit fabrication, the measurement methods used to characterize the graphene, device fabrication and the electrical properties of the devices. Also in the area of graphene, the MSTG is co-sponsoring a session called “Graphene and Carbon-based Devices”. An invited talk will cover the fabrication of large area graphene sheets. Measurement methods have long been a topic of interest to the MSTG. This year, we are co-sponsoring a number of sessions on spectroscopic ellipsometry with the Applied Surface Science, Electronic Materials, and the Thin Films group. SE is used in research, development and manufacturing by a great number of industries. In addition, recent advances have pushed SE capability in the area of nano-scale structures. Vacuum technology continues to be a critical area for manufacturing, and this year the MSTG is co-sponsoring session on gas analysis and contamination control with the Vacuum Technology Group.


The MEMS and NEMS Technical Group (MN) program will highlight recent advances in emerging areas of mechanical systems at the micro and nanoscale ranging from fundamental studies of functional, integrated devices to novel applications of micro and nanoelectromechanical systems (MEMS/NEMS). The ability to collectively manipulate, control and detect vibrational dynamics of MEMS/ NEMS raises intriguing possibilities of integrating these devices with existing fluidic, electronic and optical on-chip networks. This year’s session will cover these areas which are thematically related to fabrication and multi-scale interactions of ultra-thin, lithographically defined atomic sheets for biological and chemical sensing, integration, packaging and reliability of MEMS and NEMS, and characterization of micro- and nano-electromechanical systems. Additionally, the application of MEMS and NEMS devices to the sensing arena by employing local biochemically functionalized nanoscale sites on the surface of NEMS oscillator arrays for selective biomolecular adsorption, integration with active CMOS architectures for RF-MEMS applications, high-Q resonant dynamics in air, ultra-nanocrystalline diamond nanowires and thin film nanostructuring, an integrated micro gas chromatography system, and advanced nanofabrication techniques are the core topics of discussion.

MEMS and NEMS has organized a strong program consisting of two core oral sessions and joint sessions with Nanomanufacturing Science and Technology (NM), Plasma Science and Technology Division (PS), Graphene and Related Materials (GR), Vacuum Technology Division (VT), Nanometer-scale Science and Technology Division (NS), Applied Surface Science Division (AS), Surface Science Division (SS), and Thin Film Division (TF). The program opens with an invited talk from K. Bohringer covering heterogeneous microsystem integration through the use self assembly. The second session opens with an invited talk from D. Lopez discussing the fundamentals of near-field interactions between mechanical systems and their relevance as devices evolve from micro- to nanoscale structures. The third invited talk by C. S. Gudeman will discuss wafer scale hermetic packaging of MEMS devices, including the diverse methods used to achieve truly hermetic packaged structures, the integration of Through Silicon Vias (TSV), as well as presenting insights into the performance of these techniques from a manufacturing perspective. The final invited talk from M. A. Guillorn will discuss the unique role lithography and patterning play in determing the performance of densely scaled CMOS devices employing non-planar multi-gate structures.

Session Code

Session Title
MN-ThA Multi-scale Interactions of Materials and Fabrication at the Micro- and Nano-scale
Karl Bohringer, University of Washington
MN-FrM Characterization of Materials and Structures at the Micro- and Nano-scale
Daniel Lopez, Argonne National Laboratory



The Nanometer-scale Science and Technology Division (NS) explores the exciting and rapidly evolving science and technology enabled by nanoscale structures. Researchers from around the globe will present their work on topics ranging from fabricating atomically precise devices to exploiting nano-scale control of materials for biological applications and to control light. Multiple themes are explored such as assembly of nanoparticles and nanowires, molecular patterning and devices, and the challenges of characterizing such structures. We have invited leading figures who will provide perspective from the forefront of their respective fields and will highlight the sessions on frontiers of imaging and characterization at the nanoscale, nanowires and nanoparticles – synthesis and characterization, nanowires and nanoparticles – assembly, applications, and devices, carbon-based nanomaterials, biological nanomaterials, and nano-photonics and plasmonics. Additional co-sponsored sessions cover the areas of manufacturing nanoscale devices, nanostructures for energy conversion, nanostructures for energy storage, nano-mechanics and nanotribology, graphene chemistry, graphene nanoribbons, organic photovoltaics, and in-situ scanning probe microscopy and spectroscopy.

Session Code

Session Title
NS+EM-MoM Nanowires and Nanoparticles I: Assembly and Devices
Theresa Mayer, Penn State University
Lars-Erik Wernersson, Lund Univ, Sweden
NS-MoA Frontiers in Nanophotonics and Plasmonics
Evelyn Hu, Harvard University
NS-TuM Nanowires and Nanoparticles II: Characterization and Synthesis
Lars Samuelson, Lund University, Sweden
NS+AS-TuA Frontiers in Nanoscale Imaging and Characterization
Don Eigler, IBM Almaden Research Center
Wilson Ho, University of California, Irvine*
NS-TuP Nanometer-scale Science and Technology Division Poster Session
NS-WeM Carbon-Based Nanomaterials
Phaedon Avouris, IBM T.J. Watson Res Ctr
NS-ThM Molecular Assembly and Devices
Latha Venkataraman, Columbia University
NS-ThA Biological Nanomaterials
Weiwei Gao, Brigham and Women’s Hospital and Harvard Medical School
Stanislav Gorb, Zoological Institute at the University
of Kiel, Germany


The 2011 Plasma Science and Technology Division (PSTD) highlights state-of-the-art advances in plasma research, ranging from fundamental studies of plasma physics and chemistry to applications for electronic, bio-medical and memory device fabrication. The core program includes sixteen oral sessions and a poster session, as well as additional joint sessions with new focus topics “Spectroscopic Ellipsometry for Photovoltaics and Inorganic Thin Films”, “Plasmas for Photovoltaics & Energy Applications”, “Marine Antifouling Coatings” and plasma processing for graphene. The week begins with a focus on advanced FEOL and BEOL etch topics relevant to the semiconductor industry, as well as sessions on multiphase and biological related plasmas. The week continues with sessions covering the emerging areas of plasma science such as atmospheric plasma processing, neutral beam and low damage plasma processing and plasmas for disruptive technologies such as 3D integration (TSVs) & Non-Volatile memory device fabrication. The first of multiple sessions that cover plasma-surface interactions and diagnostics begins on Wednesday morning. The program is rounded out with PSTD core interests including plasma modeling, thin films, and novel plasma sources.

Professor Vincent Donnelly will deliver the 2011 John A. Thornton Memorial Award & Lecture entitled “As Device Dimensions Continue to Shrink… A Journey through Thirty Years of Plasma Etching Diagnostics and Mechanisms” on Tuesday Afternoon. Professor Mohan Jankaran, who received the Peter Mark Memorial Award for outstanding theoretical or experimental work by a young scientist or engineer, will present a lecture entitled “Microscale, Atmospheric-Pressure Plasmas: A Platform For Nanomaterials Synthesis At Different Length Scales” on Wednesday morning.

Lastly, both Professor Eray Aydil (2009) and Prof. Seji Samukawa (2010) will deliver Plasma Prize invited lectures on Thursday. Professor Samukawa will deliver his talk entitled “Super-low Damage Top-down Processing for Future Nanoscale Devices” on Thursday morning while Professor Aydil will present his lecture on “The Role of Atomic Hydrogen on Plasma Synthesis of Carbon Nanotubes” on Thursday afternoon.

There are multiple finalists for the 2011 Coburn and Winters Student Award, who will be presenting throughout the week (see program for specific times). The winner will be announced at 2pm on Thursday. The 2011 Plasma Prize winner will also be announced at the PSTD Business Meeting on Tuesday evening at 5:40p.m immediately following the John A Thornton Memorial Award Lecture.

Session Code

Session Title
PS-MoM Advanced FEOL / Gate Etching I
Maxime Darnon, CNRS-LTM, France
PS+BI-MoA Multiphase (Liquid, Solid, Gas) and Biological Related Plasmas
Peter Bruggeman, Eindhoven U of Tech, Netherlands
PS+SE-MoA Advanced FEOL / Gate Etching II
Deirdre Olynick, Lawrence Berkeley National Lab
PS+MN+TF-TuM Plasma Processing for Disruptive Technologies
Christopher Gudeman, IMT
Mark Kiehlbauch, Micron Technology, Inc.
Yasuhiro Morikawa, ULVAC, Inc., Japan
PS-TuM Advanced BEOL / Interconnect Etching I
Masanaga Fukasawa, Sony Corporation, Japan
PS1-TuA Advanced BEOL / Interconnect Etching II
Eric A. Hudson, Lam Research Corp.
PS2-TuA Plasma Diagnostics, Sensors and Control I
Vincent Donnelly, University of Houston*
PS+SE-WeM Atmospheric Plasma Processing and Micro Plasmas
Jan Benedikt, Ruhr-University Bochum, Germany
Mohan Sankaran, Case Western Reserve Univ*
PS+SS-WeM Plasma Surface Interactions (Fundamentals & Applications) I Takeshi Kitajima, Natl Defense Academy, Japan
PS+EM-WeA Low-K Materials & Integration
Tony Heinz, Columbia University
PS-WeA Plasma Sources
John Caughman, Oak Ridge National Laboratory
Lee Chen, Tokyo Electron America
PS+TF-ThM Plasma Deposition and Plasma Enhanced ALD
Colin Wolden, Colorado School of Mines
PS-ThM Neutral Beam and Low Damage Processing
Seiji Samukawa, Tohoku University, Japan
PS+SS-ThA Plasma Surface Interactions (Fundamentals & Applications) II
Eray Aydil, University of Minnesota
PS-ThA Plasma Diagnostics, Sensors and Control II
Edward Barnat, Sandia National Laboratories
PS-ThP Plasma Science and Technology Poster Session
PS-FrM Plasma Modeling
Natalia Yu Babaeva, University of Michigan



The Surface Science Division (SS) provides a forum for cutting-edge research that involves solid surfaces and interfaces. Phenomena that take place at the gas-solid and liquid-solid interfaces are prominent within the Division programs. Technical sessions address atomistic, electronic and chemical phenomena at surfaces and interfaces, their impact on materials properties, and their implication for technology and environmental processes.

Surface Chemistry is an important divisional theme, encompassing the kinetics and dynamics of surface chemical events from adsorption and reaction to catalysis. Film growth is another key theme, explored from a fundamental perspective, through the development of new growth and processing methods for materials preparation. Surface chemical modification is an important focus, as is the interaction of surfaces with radiation, energetic species and charged particles. This year’s program offers lively sessions devoted to the surface science of newly discovered materials and their emergent properties, as well as the metallic, semiconductor, oxide and organic surfaces that support unique chemical activity and electronic properties. Surface science applications in high-impact areas - particularly energy science, nanotechnology, and environmental science - are prominent at the 2011 Symposium: The latest findings in reaction activation and mechanisim of energetic processes are showcased in sessions devoted to surface chemical reaction, catalysis and dynamics. The impact of nanoparticle shape, size, and composition on reaction selectivity is explored in papers based upon direct experiment and computational surface science. Sessions devoted to Self Assembled Monolayers, Organic, Semiconductor and Ferroelectric Interfaces describe the controlled formation of materials interfaces for efficient charge separation, chemical and bioanalytical sensing. Sessions devoted to experimental and theoretical study of environmental systems, electrochemistry, and oxide surfaces present new model systems and approaches to understand atomistic processes at mineral – aqueous and aerosol-vapor interfaces. The Surface Science Division is also co-sponsoring focused sessions on tribology, transparent conductors, graphene on SiC, GaN, actinides, photocatalysis and solar fuels, in-situ microscopy, and spectroscopy of interfacial chemistry/catalysis.

The Tuesday Evening Poster Session features presentations by the five Mort Traum Student Award Finalists. The Morton M. Traum Surface Science Student Award will be presented for the best student paper submitted to any session sponsored or jointly sponsored by the Surface Science (SS) Division at the AVS International Symposia. The 2011 Winner will be announced in the Traum Student Award Ceremony, to be held Thursday at noon immediately following SS-ThM.

Session Code

Session Title
SS1-MoM Water Films & Environmental Interfaces
John Hemminger, Univ of California, Irvine
Bruce D. Kay, Pacific Northwest Natl Lab
SS2-MoM Surface Chemical Dynamics
Karina Morgenstern, Leibniz U Hannover, Germany
SS1-MoA Selectivity and Reactivity of Chemisorbed Species
Bjoerk Hammer, Aarhus University, Denmark
SS2-MoA Molecular Ordering and Electrochemical Interfaces
Klaus Wandelt, University of Bonn, Germany
SS1-TuM Chemisorption & Surface Reactions
Manos Mavrikakis, U of Wisconsin Madison
SS2-TuM Self Assembled Monolayers and Networks
Trolle Rene Linderoth, U of Aarhus, Denmark
Steven Tait, Indiana University
SS+EM-TuA Organic Electronic Interfaces
Francesco Stellacci, EPFL, Switzerland
SS-TuA Catalysis on Metals and Alloys
D. Wayne Goodman, Texas A & M University
SS-TuP Surface Science Poster Session
SS1-WeM Atomistic Control of Structure & Evolution
SS2-WeM Chemisorption on Metal & Oxide Nanoparticles
Martin Sterrer, Fritz-Haber-Institute of the Max-Planck-
Society, Germany
SS-WeA Adsorption & Reactions on Oxide Surfaces
SS-ThM Oxide Surface Structure & Reactivity
Susannah Scott, U of California, Santa Barbara
SS-ThA Semiconducting & Ferroelectric Surface
Eric I. Altman, Yale University
Andrew Kummel, U of California, San Diego
SS-FrM Surface Science on Graphene
Norman Bartelt, Sandia National Labs
Yves J. Chabal, University of Texas at Dallas



This year’s Thin Film Division Program has 12 core oral sessions, several co-sponsored sessions, and one poster session. A range of outstanding invited speakers will present talks on a variety of exciting topics in each session. TFD will again highlight Atomic Layer Deposition (ALD) with 4 full sessions, focusing on Energy, Hybrid Organic Films, Fundamental Reactions, and Emerging Applications. Invited speakers include Mato Knez of Max Planck Institute speaking on ALD applications of hybrid materials, Helmut Baumgart of Old Dominion University speaking on mechanical properties of ALD films, Eric Dickey of Lotus Applied Technology speaking about roll-to-roll processing of ALD films, Myung Mo Sung of Hanyang University speaking of organic-inorganic ALD films, Brian Willis from the University of Connecticut speaking on oxide ALD films, and Gary Rubloff from the University of Maryland speaking on ALD for energy applications, to name a few.

Other core sessions include “Thin Film Growth and Characterization”, featuring Jon-Paul Maria from North Carolina State University speaking about Flux and Surfactant-Assisted PVD. A session on “Modeling and Analysis of Thin Films” will feature Oleg Mryasov from the University of Alabama who will be discussing magnetic thin films. We expect another year of an exciting session on “Glancing Angle Deposition (GLAD)”, co-sponsored by Surface Engineering. The Thin Film-led session features Motofumi Suzuki, who will be speaking about GLAD for practical applications. Nanostructuring Thin Films will highlight Carl Thompson from MIT, who will be discussing template solid-state dewetting for patterning thin films. In its second year Nonvolatile Memories will feature Eric Joseph from IBM speaking about phase change and spin torque memory technologies and Christian Wenger from IHP, who will be discussing RRAM technology. New to this year is an exciting session on Self Assembled Monolayers that is co-sponsored by EMPD and will feature Han Zuilhof from Wageningen University, who will be discussing organic monolayers on silicon substrates.

The Thin Film Division is proud to contribute numerous sessions to various Focus Topics that include: 3 sessions to the Energy Frontiers Topical Symposium; 2 sessions in the Graphene Focus Topic; several co-sponsored sessions in the Focus Topic on Spectroscopic Ellipsometry; etc... A Thin Films Poster Sessions held on Tuesday evening will cover a diverse range of topics drawn from all the Thin Film sessions.

Session Code

Session Title
TF-MoM Thin Films: Growth and Characterization I
Jon-Paul Maria, North Carolina State Univ
TF-MoA Emerging ALD Applications
Vladimir Kuznetsov, Levitech BV, Netherlands
TF+EN-TuM ALD for Energy
Gary Rubloff, University of Maryland
TF+SE-TuM Glancing Angle Deposition (GLAD)
Motofumi Suzuki, Kyoto University, Japan
TF-TuA ALD Fundamental Reactions and Film Properties
Sumit Agarwal, Colorado School of Mines
Helmut Baumgart, Old Dominion University
Brian Willis, University of Connecticut
TF-TuP Thin Films Poster Session
TF1+EM-WeM ALD/MLD: Hybrid Organic Films
Mato Knez, Max-Planck-Inst Mikrostrukturphysik,
Myung Mo Sung, Hanyang University, Korea
TF1+EM-WeA Nonvolatile Memory
Eric Joseph, IBM T.J. Watson Res. Ctr.
Christian Wenger, IHP, Germany
TF2+EM-WeA Nanostructuring Thin Films
Carl Thompson, MIT
TF1-ThM Post-Deposition Processing and Characterization of Thin Films
Yue Kuo, Texas A&M University
TF2-ThM Modeling and Analysis of Thin Films
Oleg Mryasov, University of Alabama
TF+EM+SS-ThA Applications of Self Assembled Monolayers
Nitin Chopra, Univ of Alabama, Tuscaloosa
Han Zuilhof, Wageningen Univ, Netherlands
TF-FrM Thin Films: Growth and Characterization II


The Vacuum Technology Division (VT) program covers a broad array of research including vacuum measurement, calibration, gas flow, permeation, pumping, outgassing, gas analysis, and vacuum for accelerators & large systems. A multi-disciplinary session highlights the impact of surface science advances on the development of the next generation of novel electronic materials, as well as surface science applied to accelerators. Our oral sessions have an impressive list of invited speakers. Joe Stroscio of NIST will share his expertise with building a new UHV low temperature scanning probe microscopy facility for the study of future electronic materials. Roberto Kersevan will present numerical methods for the design of vacuum systems, emphasizing the Molflow+ software used for the ITER tokamak under construction in France. Dick Hseuh, Brookhaven National Lab, will discuss his experiences with the construction of the National Synchrotron Light Source vacuum system. Joe Hodges, NIST, will share his cutting edge developments in using optical methods to determine ultra-low concentrations of water vapor. Christian Day of Karlsruhe Institute of Technology will cover modeling and simulation of the ITER pumping systems. Mike Duncan of Oak Ridge National Laboratory will discuss current work on extending the range of the spinning rotor gauge. In joint session between VT and energy frontiers (EN), Lindsey VanMannes, South Park Platinum, will cover the use of vacuum processing in the refining of rare earth elements used in Photovoltaics manufacturing. The VTD poster session and student poster competition Tuesday evening represents contributions on a wide variety of vacuum research topics. VTD will again host the “Ask the Experts” booth where experienced vacuum scientists, engineers and technicians will strive to answer perplexing vacuum technology issues. The booth is located in the exhibit area and staffed during exhibit hours. Bring your questions!

Session Code

Session Title
VT-MoM Vacuum Measurement, Calibration & Primary Standards,
Gas Flow and Permeation

Michael Duncan, Oak Ridge Natl Lab
VT-MoA Optical and Mass Spectroscopy for Gas Analysis and Pump Modeling
Joseph Hodges, NIST
Roberto Kersevan, ITER Intl Organization, France
VT-TuM Accelerator and Large Vacuum System Design, Outgassing and Pumping
Christian Day, Karlsruhe Inst of Tech, Germany
Hsiao-Chaun Hseuh, Brookhaven Natl Lab
VT+MN+NS+SS+AS-TuA Surface Science for Future Electronic Materials and Accelerator Applications
Joseph Stroscio, NIST
VT-TuP Vacuum Technology Poster Session & Student Poster Competition


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