• Advanced Surface Engineering (SE)
• Applied Surface Science (AS)
• Biomaterial Interfaces (BI)
• Electronic Materials & Processing (EM)
• Magnetic Interfaces & Nanostructures (MI)
• MEMS & NEMS (MN)
• Manufacturing Science & Technology (MS)
• Nanometer-scale Science & Technology (NS)
• Plasma Science & Technology (PS)
• Surface Science (SS)
• Thin Film (TF)
• Vacuum Technology (VT)
  

 

Advanced Surface Engineering Division (SE)

The program of the Advanced Surface Engineering Division (SE) addresses both scientists as well as technologists who are interested in new thin film materials and emerging technologies to prepare them, who need to know about their characterization and who aim at their practical use. The five oral ASED sessions, partly co-organized with other divisions, and the poster session provide a balanced mix of fundamentals and applications of surface engineering. These sessions (see below for a complete list) will particularly emphasize the basics and use of atmospheric pressure plasmas; new developments in nanostructured thin films coatings, the possibilities of glancing angle deposition, novelties in pulsed plasma processes and innovations in surface engineering for thermal management. In conjunction with the Thin Films Division (TF) a wide range of aspects in tribology are covered in joint sessions. Under these topics, presentations on novel coating materials, processes to prepare them, design and modeling, diagnostics and growth control, mechanical property characterizations, resistance to severe conditions, thermal stability and other aspects related to surface engineering and coatings are solicited.

• SE1+PS Atmospheric Pressure Plasmas
  Michael Kong, Longborough University, UK, "Cold Atmospheric Plasma Sources for Surface Treatment"

• SE2 Nanostructured Thin Films and Coatings
  Sam Zhang, Nanyang Technological University, Singapore, "Hard Yet Tough Nanocomposite Coatings"

• SE3 Glancing Angle Deposition (GLAD II)
  Gwo-Ching Wang, Rensselaer Polytechnic Institute, "Evolution of Crystal Orientation during Oblique Angle Deposition"

• SE4+PS Pulsed Plasmas in Surface Engineering
  Jaroslav Vlcek, University of Western Bohemia, Czech Republic, "Pulsed Magnetron Sputtering Systems for Reactive Deposition of Oxide and Nitride Films"

• SE5+SS Surface Engineering for Thermal Management
  Gang Chen, Massachusetts Institute of Technology, "Near-field Radiation Heat Transfer"

• SE6 Advanced Surface Engineering Poster Session

• PS9+SE Atmospheric Plasma Processing and Micro Plasmas
  Jan Benedikt, Ruhr-Universität Bochum, Germany, “Deposition of SiOx Material by Means of Atmospheric Pressure Microplasma Jet: The Study of Deposition Mechanism”

• PS14+SE Fundamentals of Pulsed Plasmas and Gas Breakdown
  John Caughman, Oak Ridge National Laboratory

• TF11+SE Glancing Angle Deposition (GLAD) I
  Motofumi Suzuki, Kyoto University, Japan, "Progress in Glancing Angle Deposition Technology for Practical Applications"

 

Applied Surface Science Division (AS)

Applied Surface Science is of major importance to innovation and manufacturing across a broad range of industrial sectors as well as fundamental research. The Applied Surface Science Division (AS) focuses on topics including quantitative surface analysis and data interpretation, practical surface analysis (e.g. insulators and challenging samples), recent developments and applications of techniques. We welcome original work in electron and optical spectroscopies, all aspects of surface mass spectrometry, multi-technique analysis and, this year, have a special emphasis on scanning probe microscopy in a joint session with Biomaterial Interfaces (BI) and Nanometer-scale Science & Technology (NS) Divisions. We welcome abstracts on techniques such as atom probe tomography and combined surface analysis with FIB to our 3D chemical analysis session. This year we are delighted to co-sponsor the BI plenary session with a theme of “Challenges in Biomaterials Analysis” as well as joint sessions on the characterization and functionalization of nanoparticles. We are excited to support the AVS Focus Topics on Spectroscopic Ellipsometry (EL), Helium Ion Microscopy (HI), In Situ Spectroscopy and Microscopy (IS), Tribology (TR) and Transparent Conductors and Printable Electronics (TC). Our popular annual poster session will cover all aspects of applied surface science. Students are encouraged to participate in the student presentation competition; both posters and oral presentations will be considered.

• AS1 Quantitative Surface Chemical Analysis and Technique Development
  Sven Tougaard, University of Southern Denmark, "Characterization of Nano-structures from Analysis of the XPS Background: Automation and 3D-imaging"

• AS2 Imaging and 3D Chemical Analysis
  Takuya Miyayama, ULVAC-PHI, Japan, "Recent Applications of GCIB Depth Profiling with XPS and TOF-SIMS"
  Wilfried Vandervorst, IMEC, Belgium, "Advances in Probing 3D Semiconductor Structures"

• AS3 Correlative Analysis - A Multi-technique Approach for Identification and Structure-Property Relationships
  Kathryn G. Lloyd, DuPont Corporate Center for Analytical Sciences, "Challenges with Multi-technique Correlation of Surface Analytical Methods"

• AS4 Analysis of Insulators and Challenging Samples
  Donald R. Baer, Pacific Northwest National Laboratory, "Working with Difficult Samples - Preparation, Damage, Charging and Data Analysis"

• AS5+BI Quantitative Chemical Analysis of Soft Materials and Biomaterials
  Ralf Richter, CIC biomaGUNE, Spain, "Surface-based Model Systems of Biomolecular Hydrogels - From Supramolecular Organization and Dynamics to Biological Function"

• AS6+BI Nano-Object (including Nanoparticles) Chemical Characterization
  Emile Schweikert, Texas A&M University, "Characterization of Nano-objects by Cluster-SIMS"

• AS7+BI+NS Advances in Scanning Probe Microscopy
  Toshio Ando, Kanazawa University, Japan, "High-Speed Atomic Force Microscopy for Filming Biomolecular Processes"
  Christopher Yip, University of Toronto, Canada, "Advances in Characterizing Membranes and Cells using Atomic Force Microscopy"

• AS8 Applied Surface Science Poster Session

• BI4+AS+NS+SS  Surface Functionalization of Nanostructures
  Holger Schönherr, University of Siegen, Germany, "Surface Functionalization and Analysis of Functional "Soft" Nanostructures: From 2 to 3 Dimensions"

• BI5+AS Characterization of Biomedical Materials

• BI7+AS Quantitative Analysis of Biomaterials
  Erika Johnston, Genzyme, "Industrial Biosurface Analysis: A Surfeit of New Frontiers"

• BP1+AS Challenges in Biomaterials Analysis
  David Castner, University of Washington, "Wants, Needs, and Challenges in Biomedical Surface Analysis"
  Yves Dufrene, Université catholique de Louvain, Belgium, "Nanoscale Surface Analysis of Living Cells using Atomic Force Microscopy"
  Alex Shard, National Physical Laboratory, UK, "Depth Profiling and 3D Analysis of Organic Surfaces"

• EL1+AS+TF+MS+EM+PS Spectroscopic Ellipsometry for Photovoltaics and Inorganic Thin Films
  Dean Levi, National Renewable Energy Laboratory, "Applications of Ellipsometry in Photovoltaics"

• EL2+AS+TF+MS+EM+PS Spectroscopic Ellipsometry of Organic and Biological Materials
  Klaus-Jochen Eichhorn, Leibniz-Institut für Polymerforschung Dresden e.V., Germany, "Application of Various Spectroscopic Ellipsometry Techniques for In Situ Studies of Thin Polymer Films on Solid Substrates"

• EL3+AS+TF+MS+EM+PS Spectroscopic Ellipsometry – Fundamentals, New Techniques, & Future Directions
  James Hilfiker, J.A. Woollam Co., Inc., "Current Trends and Future Outlook for Spectroscopic Ellipsometry"

• HI1+AS Basics of Helium Ion Microscopy
  David C. Bell, Harvard University, "Applications of Helium Ion Microscopy"
  Colin A. Sanford, Carl Zeiss, Inc., "Principles of Helium Ion Microscopy"

• HI2+AS+BI+NS Nano- and Bio- Imaging with Helium Ion Microscopy
  Daniel S. Pickard, National University of Singapore, "Aspects of BioImaging"
  Hongzhou Zhang, Trinity College, Ireland, "Imaging of Nanostructures"

• IS1+AS+SS In Situ Surface Science Studies
  Miquel Salmeron, Lawrence Berkeley National Laboratory, “The changing structure of surfaces when in gaseous and liquid environments”

• IS2+AS+SS In Situ Film Growth Studies
  Guus Rijnders, University of Twente, the Netherlands, “Real-time Growth Characterization using Atomic Force Microscopy”

• IS3+AS In Situ Studies in Novel Environments
  Niels De Jonge, Vanderbilt University, “Imaging Whole Cells in Liquid with Scanning Transmission Electron Microscopy”

• IS4+AS+SS In Situ Beam-Scattering Studies
  Anatoly Frenkel, Yeshiva University, “In Situ X-Ray Studies”

• IS5+AS In Situ Studies of Structure & Mechanical Properties
  Ian Robertson, University of Illinois at Urbana-Champaign and National Science Foundation, "In Situ TEM Studies of Structural Evolution"

• NM6+AS+MS Metrology for Nanomanufacturing
  Dawn Bonnell, University of Pennsylvania, “Local Probes Enabling Science and Manufacturing”

• NT1+AS+MI Magnetic Thin Films and Multilayers
  Thomas Brueckel, Forschungszentrum Jülich, Germany
  Chris Leighton, University of Minnesota, “Nanoscopic "Magnetic Phase Separation at the SrTiO3/La1-xSrxCoO3 Interface”

• NT2+AS Neutron Scattering for Energy Conversion
  Jerzy Chlistunoff, Los Alamos National Laboratory, "Nafion-Carbon-Platinum Interfaces Studies using Neutron Scattering and Electrochemical Methods"
  Michael Kent, Sandia National Laboratories

• NT3+AS+BI Biological Interfaces, Membranes, Thin Films
  Eva Y. Chi, University of New Mexico
  Mike Reinschtedter, McMaster University, Canada

• TC1+AS Growth, Processing, and Characterization of Transparent Conductors
  Su-Huai Wei, National Renewable Energy Laboratory, "Multi-component Transparent Conducting Oxides: Progress in Materials Modeling"

• TR2+AS+SS Atomic-scale Characterization of Tribological Interfaces
  Michael Falk, Johns Hopkins University, "Accelerated Molecular Dynamics Simulations of Tribological Interfaces"

Biomaterial Interfaces Division (BI)

In the tradition of the Biomaterial Interfaces Division (BI), a broad technical program has been established that is focused on progress in biointerface science and engineering bringing together an interdisciplinary group of experts that work at the intersection of biosurface and interface science, the nanosciences, and biomedical engineering. The BID technical program for the week incorporates classical topics such as Cells at Interfaces (including stem cells, bacteria, etc.), Biomolecules at Interfaces (Protein, peptide, DNA and sugar interactions), Characterization of Biomedical Materials and Protein-Membrane Interactions. These sessions are designed to appeal to the core of the Biomaterials Interface Division by focusing on new developments in the key strengths that have appealed to our members, while also including some new ways of looking at these classic BI topics.

• BI1 Cells at Interfaces
  Pieter Dorrestein, University of California at San Diego, "Analysis of Cells at Interfaces"
  Todd McDevitt, Georgia Institute of Technology, "Engineering Stem Cell Differentiation via Material Properties"

• BI2 Biomolecules at Interfaces
  Rein Uljin, University of Strathclyde, UK, "Enzyme-Responsive Surfaces"

• BI3 Protein-Membrane Interactions
  Matthias Loesche, Carnegie Mellon University, "Membrane binding, structure and regulation of the PTEN phosphatase"

• BI4+AS+NS+SS  Surface Functionalization of Nanostructures
  Holger Schönherr, University of Siegen, Germany, "Surface Functionalization and Analysis of Functional "Soft" Nanostructures: From 2 to 3 Dimensions"

• BI5+AS Characterization of Biomedical Materials
  Larry Salvati, DePuy Orthopaedics, "Characterization of Biomedical Materials"

• BI6 Sensors and Fluidics for Biomedical Applications
  Jennifer Shumaker-Perry, University of Utah, "Combining Microfluidics and Plasmon Sensing to Assess Immunogenicity"

• BI7+AS Quantitative Analysis of Biomaterials
  Erika Johnston, Genzyme, "Industrial Biosurface Analysis: A Surfeit of New Frontiers"

• BI8 Biomaterial Interfaces Poster Session

• AS5+BI Quantitative Chemical Analysis of Soft Materials and Biomaterials
  Ralf Richter, CIC biomaGUNE, Spain, "Surface-based Model Systems of Biomolecular Hydrogels - From Supramolecular Organization and Dynamics to Biological Function"

• AS6+BI Nano-Object (including Nanoparticles) Chemical Characterization
  Emile Schweikert, Texas A&M University, "Characterization of Nano-objects by Cluster-SIMS

• AS7+BI+NS Advances in Scanning Probe Microscopy
  Toshio Ando, Kanazawa University, Japan, "High-Speed Atomic Force Microscopy for Filming Biomolecular Processes"
  Christopher Yip, University of Toronto, Canada, "Advances in Characterizing Membranes and Cells using Atomic Force Microscopy"

• BN1+BI+MN Biofabrication Methods and Devices
  David Kaplan, Tufts University
  Jeffrey Morgan, Brown University / Rhode Island Hospital

• BN2+BI+MN Biofabrication Applications
  William Bentley, University of Maryland
  Michael Shuler, Cornell University

• HI2+AS+BI+NS Nano- and Bio- Imaging with Helium Ion Microscopy
  Daniel S. Pickard, National University of Singapore, "Aspects of BioImaging"
  Hongzhou Zhang, Trinity College, Ireland, "Imaging of Nanostructures"

• MB2+BI+PS Marine Antifouling Coatings
  John Schetz, University of North Texas Health Science Center, “Advances in Sustainable Technologies for the Prevention of Marine Biofouling”

• NT3+AS+BI Biological Interfaces, Membranes, Thin Films
  Eva Y. Chi, University of New Mexico
  Mike Reinschtedter, McMaster University, Canada

• PS12+BI Plasmas for Medicine and Biological Applications

Electronic Materials and Processing Division (EM)

The Electronic Materials and Processing Division (EM) sponsors sessions on electronic materials synthesis, processing, characterization, and structure-property relationships. Abstracts are solicited pertaining to a wide range of inorganic and organic electronic materials, ranging from conductors to semiconductors to dielectrics and insulators. Sessions on electronic material surfaces and self-assembled monolayers, defects in electronic materials, hybrid and organic films, nanowire devices, and semiconductor growth are planned. Sessions on high-k, low-k, and memory dielectrics will be a special feature this year, and new sessions on emerging electronic materials, such as topological insulators and next-generation electronics will highlight cutting-edge research. In addition, EM is sponsoring a separate focus topic on transparent conductors and printable electronics, and is co-sponsoring sessions on photonics and plasmonic materials and in the Energy Frontiers and Graphene focus topics.

• EM1+TF Activation and Deactivation of Surfaces with Self-assembled Monolayers
  W. Grant McGimpsey, Worcester Polytechnic Institute, "Chemical Modification of Surfaces for Biological Applications"

• EM2 Defects in Electronic Materials
  Leonard J. Brillson, The Ohio State University, "Controlling Schottky Barriers and Doping with Native Point Defects"

• EM3 Hybrid and Organic Electronic Materials
  Seong-Il Im, Yonsei University, Korea, "Organic/Oxide Hybrid Thin-Film Applications for Photo-detector Cells and Complementary Inverters"
  Manuel Quevedo, University of Texas at Dallas, "Hybrid Organic/Inorganic Materials and Devices for Flexible Electronics Applications"

• EM4+TF High-k Dielectrics
  Marc Heynes, IMEC, Belgium, "High Mobility Channel Materials and Novel Devices for Scaling of Nanoelectronics beyond the Si Roadmap"
  Minghwei Hong, National Tsing Hua University, Taiwan, "Research Advances on III-V and Ge MOSFETs Beyond Si CMOS"
  Paul McIntyre, Stanford University, "Bilayer Gate Stacks for High-k Gates on Ge and InGaAs"
  Eric Vogel, University of Texas at Dallas, "A Comprehensive Electro-physical Model for the Mobility of In0.53Ga0.47As Surface Channel MOSFETs"

• EM5 Memory Dielectrics
  Cheol-Seong Hwang, Seoul National University, Korea, "Johnson-Mehl-Avrami Type Kinetic Model for Resistance Switching in TiO₂
  Derchang Kau, Intel Corp., "A Survey of Cross Point Phase Change Memory Technologies"
  Gabriel Molas, CEA LETI, France, "Charge Trap Memories and 3D Approaches"
  Kang Wang, UCLA, "Oxides for Spintronics"

• EM6 Low-k Dielectrics
  George Antonelli, Novellus Systems, Inc., "Advanced Pre-Treatments and Low-k Dielectric Barrier Technology for Beyond 2x nm Node"
  Reinhold Dauskardt, Stanford University, "Molecular Strengthening Mechanisms for Low-k Dielectrics"
  Al Grill, IBM T.J. Watson Research Center, "Ultralow-k PECVD pSiCOH Dielectrics and their Implementation in VLSI Interconnects"
  Tony Heinz, Columbia University, "Electric and Optical Characterization of Leakage and Breakdown in Low-k Dielectric Materials"

• EM7 Dielectrics for Novel Devices and Process Integration
  Mihaela Balseanu, Applied Materials Inc., "Boron Nitride Development and New Applications for sub-20nm Device Fabrications"
  Tetsuo Endoh, Tohoku University, Japan, "Impact of Vertical Structured Devices for Future Nano LSI"
  Alan Seabaugh, University of Notre Dame, "Interface Traps and Low Subthreshold Swing in III-V Tunnel FETs"
  Do Yeung Yoon, Seoul National University, Korea, "Novel Polysilsesquioxane Systems for Ultralow-Dielectric Films with High Modulus, Low CTE, and Closed-Pore Morphology"

• EM8 Interfaces and Transport in Semiconductor Materials

• EM9+NS Nanowire Electronic Devices
  Lars-Erik Wernersson, Lund University, Sweden

• EM10 Topological Insulators
  M. Zahid Hasan, Princeton University, "Bulk Topological Insulators and Superconductors: Discovery and the Frontier"

• EM11 Next Generation Electronics
  Tomas Palacios, Massachusetts Institute of Technology, "High Frequency Electronics based on GaN and Graphene"

• EM12 Semiconductor Growth

• EM13+SS Structure and Morphology of Electronic Material Surfaces

• EM14 Electronic Materials and Processing Poster Session

• EL1+AS+TF+MS+EM+PS Spectroscopic Ellipsometry for Photovoltaics and Inorganic Thin Films
  Dean Levi, National Renewable Energy Laboratory, "Applications of Ellipsometry in Photovoltaics"

• EL2+AS+TF+MS+EM+PS Spectroscopic Ellipsometry of Organic and Biological Materials
  Klaus-Jochen Eichhorn, Leibniz-Institut für Polymerforschung Dresden e.V., Germany, "Application of Various Spectroscopic Ellipsometry Techniques for In Situ Studies of Thin Polymer Films on Solid Substrates"

• EL3+AS+TF+MS+EM+PS Spectroscopic Ellipsometry – Fundamentals, New Techniques, & Future Directions
  James Hilfiker, J.A. Woollam Co., Inc., "Current Trends and Future Outlook for Spectroscopic Ellipsometry"

• EN9+EM+NS Nanostructured Materials for Third Generation Solar Cells
  Sheila Bailey, NASA Glenn

• EN11+EM+NS Nanowire Solar Cells
  Michael Filler, Georgia Institute of Technology
  Ali Javey, University of California Berkeley

• ET1+EM+SS Quantum Transport: Fundamentals
  Shuji Hasegawa, University of Tokyo, Japan, "Multi-Probe STM Study of 2-D Transport on Surface State"

• ET2+NS+EM Nanoelectronics, Interconnect, and Energy Applications
  Hanno H. Weitering, University of Tennessee, "1-D Transport in Atomic Structures"

• ET4+EM+NS New Developments in Transport Theory and Techniques
  Art Baddorf, Oak Ridge National Laboratory, "Domain Wall Transport in Ferroelectric Materials"
  Harold Baranger, Duke University, “Quantum Phase Transition and Emergent Symmetry in a Quadruple Quantum Dot System”

• GR2+EM Graphene: Optical Properties, Optoelectronics, Photonics and Transparent Electronics
  Andrea Ferrari, University of Cambridge, UK

• GR9+MS+EM Graphene Device Manufacturing
  Ji Ung Lee, University at Albany
  Chun-yung Sung, IBM Research

• GR10+EM Dielectrics on Graphene, Graphene Transfer to Novel Substrates

• SS8+EM Semiconductor Surfaces
  Andrew Kummel, University of California, San Diego, "An Atomic View of ALD of Dielectrics on Semiconductors Using STM"

• TF4+EM ALD/MLD: Hybrid Organic Films
  Mato Knez, Max Planck Institute of Microstructure Physics, Germany, "Hybrid Materials by Vapor Phase Infiltration"
  Myung Mo Sung, Hanyang University, Korea, “Vapor-Phase Fabrication of Organic-Inorganic Hybrid Thin Films Using Molecular Layer Deposition with Atomic Layer Deposition”

• TF8+EM Nanostructuring Thin Films
  Carl Thompson, Massachusetts Institute of Technology, "Templated Solid-State Dewetting for Patterning of Films"

• TF12+EM+SS Applications of Self Assembled Monolayers
  Nitin Chopra, University of Alabama, "Development of Nanoscale Heterostructures: from Single Component Nanostructures to Multicomponent Nanosystems"
  Han Zuilhof, University of Wageningen, the Netherlands, "Organic Monolayers on Silicon-rich Substrates: Methods and Mechanisms"