| Pacific Rim Symposium on Surfaces, Coatings and Interfaces (PacSurf 2014) | |
| Thin Films | Wednesday Sessions |
| Session TF-WeP |
| Session: | Thin Films Poster Session |
| Presenter: | JongHyun Seo, Korea Aerospace University, Republic of Korea |
| Authors: | J.H. Seo, Korea Aerospace University, Republic of Korea H.-S. Kim, Korea Aerospace University HH. Choe, Korea Aerospace University, Republic of Korea J.-H. Jeon, Korea Aerospace University, Republic of Korea J.H. Yoon, Korea Aerospace University, Republic of Korea |
| Correspondent: | Click to Email |
In this work, the adhesion properties sputtered molybdenum (Mo) thin films as a copper (Cu) diffusion barrier layer on polymer substrates were examined using micro-scratch tests. We fabricated trench type copper interconnect rather than typical metal inlaying type.
There was made a comparison of the mechanical properties between a new trench copper layer and a traditional metal inlay type copper interconnect by means of photolithography technique followed by wet patterning. The metal / polymer interface were examined by using the auger electron spectroscopy. Cu/Mo trench typed films have 50% higher values of adhesion forces than that of Cu/Mo inlay type. A physical modeling is proposed, on average volume stress analysis to explain an improvement in the mechanical stability of the buried Cu interconnects in the flexible substrate.