Pacific Rim Symposium on Surfaces, Coatings and Interfaces (PacSurf 2014)
    Thin Films Tuesday Sessions
       Session TF-TuP

Paper TF-TuP8
A Study on Amorphous InGaZnO Thin Film Transistor with Wet Etched Copper/Molybdenum Alloy Electrode

Tuesday, December 9, 2014, 4:00 pm, Room Mauka

Session: Thin Films Poster Session
Presenter: JongHyun Seo, Korea Aerospace University, Republic of Korea
Authors: J.H. Seo, Korea Aerospace University, Republic of Korea
J.-H. Jeon, Korea Aerospace University, Republic of Korea
HH. Choe, Korea Aerospace University, Republic of Korea
J.H. Yoon, Korea Aerospace University, Republic of Korea
H.-S. Kim, Korea Aerospace University
Correspondent: Click to Email

We fabricated the back channel etch type copper/molybdenum alloy/Indium gallium zinc oxide thin film transistors using only wet patterning in phosphoric acid based copper etchant. Compared with pure molybdenum S/D electrode, New Mo alloy electrodes showed better TFT performances both in mobility and on current. The mobility was increased by 50% and on current increased up to 100% compared to those of pure molybdenum electrodes. Little is know about the effect of S/D electrode material on the electrical properties of amorphous IGZO oxide TFTs.

A modeling based on the reduced elastic strain energy by reduction in biaxial elastic modulus of the Mo alloy film is proposed to explain enhanced electrical properties of Cu/Mo alloy/IGZO TFT. The effects of alloy percentage in the alloy, chemical additives on the electrical properties of back channel etch type Cu/Mo alloy/IGZO oxide TFTs were investigated using surface analysis and electrochemical methods.