| Pacific Rim Symposium on Surfaces, Coatings and Interfaces (PacSurf 2014) | |
| Nanomaterials | Wednesday Sessions |
| Session NM-WeM |
| Session: | Nano Composites |
| Presenter: | HyoTae Kim, Korea Institue of Ceramic Engineering and Technology, Republic of Korea |
| Authors: | C.H. Kim, Korea University, Republic of Korea S. Nahm, Korea University, Republic of Korea H.T. Kim, Korea Institue of Ceramic Engineering and Technology, Republic of Korea |
| Correspondent: | Click to Email |
High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and grapheme, recently. Among them, boron nitride(BN) and aluminum nitride(AlN) ceramics are promising candidate for high thermal conductivity with electrically insulating filler materials. This work presents an enhance heat transfer properties of ceramic/polymer and ceramic/ceramic nanocomposite films using BN/AlN nanosheets(nanoflake) and polymer resins. BN nanosheet was prepared by a chemical expoliation using organic media and subsequent ultrasonic treatment. High thermal conductivity over 5W/mK in transverse and 10W/mK in in-plane direction of cast films were achieved for BN nanosheet/polymer nanocomposites that were prepared under 250°C. Also, thermal conductivity over 5W/mK were achieved for BN/AlN nanosheets/glass ceramic composites which can be sintered under 900°C. Further improvement of thermal conductivity up to 15W/mK was achieved by applying high thermal conductivity polymers and adequate alignment of nano size ceramic sheets and high density packing through multimodal powders and two stage film forming process including first cast, resin infiltration and pressured-roll cast at elevated temperatures.