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Veeco:
Booth 200
 New from Veeco: Dektak 150 Surface
Profiler
The Dektak 150 Surface Profiler from Veeco
Metrology has been widely accepted as a superior
solution for monitoring vacuum deposition. The
Dektak 150 provides the capabilities to
accurately measure thin film thickness, stress,
surface roughness and form in industries ranging
from semiconductor research to solar cell
production.
With a variety of configurations, the Dektak
150 offers application packages for everything
from simple step height measurements to advanced
automation with programmable X-Y positioning of
wafers up to 150mm. The sub-nanometer
step-height repeatability of the Dektak 150
enables accurate measurements of step-heights
for thin films below 10 nanometers thick, as
well as thick films and curved surfaces up to
nearly one-millimeter.
The Dektak 150 provides the right
combination of measurement precision,
performance, and versatility needed to address a
wide range of research applications. The
advanced 3D surface analysis capabilities of
Veeco’s exclusive Vision® software enable
extensive characterization of surface roughness
and texture as well as routine step height
measurements.
 New from Veeco:
Mark I+ Ion Source
Veeco’s new Mark
I+ Ion Source delivers 50% higher peak beam
output and makes maintenance a snap: the
removable anode assembly with simplified power
interfaces cuts replacement time from half an
hour to two minutes. Combined with the Mark II+
Controller, you now have the complete,
cost-effective solution for high-performance End
hall applications.
Designed for
vacuum coating processes in systems of 750mm
diameter or less, the Mark I+ ion source is
ideally suited to surface preclean, assisted
deposition and some
etch
applications, which require high-current,
low-energy ions. A high beam current is
especially useful for controlling film stress
and stoichiometry. This ion source is well
suited to industrial processes, including
reactive environments. A fully automated Mark
Series Ion Source Controller (available
separately) is designed to complement source
performance characteristics to provide stable
and reliable process operation.
Take advantage of
our trade-up program for your obsolete ion
sources or visit
www.veeco.com/mark1+ for more information.
RBD
Instruments:
Booth 615
 Introducing the RBD IG2
2kV Backfill Ion Source Package:
-
Simple
-
Reliable
-
Affordable
RBD Instruments’
IG2 Ion Source Package is the
ideal solution for sputter cleaning of samples
prior to surface analysis experiments, including
Auger depth profiling. The IG2 Ion Source
Package comprises the Model 04-165 2kV Backfill
Ion Source and the Model 32-165 Ion Source
Control. These units are interchangeable with
the PHI® 04-161 and 04-162 ion guns
and the PHI® 20-045 control,
respectively. The 04-165 fits on a standard
2.75” flange and is designed for easy on site
maintenance. The 32-165 features a built-in
timer for sputtering and an hour meter to track
filament lifetime. For more detailed
specifications on the ion source and control,
download the datasheet directly from our website
or click on the web link above.
For more information about
the IG2 and other services and products we offer
please contact
sales@rbdinstruments.com or call
541-330-0723x310, visit
www.rbdinstruments.com
Vacuum Research Ltd.:
Booth 800
 Integral Sensor Active
Gauge
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1 to 2000 mTorr, $169.00
includes sensor with 2 to 10V and 0 to 10V
outputs.
-
Power required is 12 to 35
VDC.
-
1/8 inch NPT, NW-25 and all
standard flanges.
-
Available optional features
include:
-
4-20 mA output, Digital
Display and Adjustable Set Point, The RJ 45
connector is pin for pin compatible with Edwards
ATC-E
Complete specifications at
www.vacuumresearch.com.
Pfieffer Vacuum, Inc.:
Booth 706
$4950 Dry Turbo
Pumping Station
Pfeiffer Vacuum, one of the world’s leading
producers of vacuum products and services,
introduces a complete dry turbomolecular vacuum
pump station for only $4950. This plug and play
vacuum station includes a turbo and dry
diaphragm pump and is available with 63 CF or 63
ISO flange sizes. The E-Station is ideal for R&D
and vacuum applications that require
hydrocarbon-free vacuum.
Pfeiffer Vacuum’s
bench-top E-Station has a high pumping speed of
60 l/s, an ultimate pressure of <10-8 mbar and
is low on energy consumption. This dry vacuum
unit is easy to service with a DCU that allows
control and diagnostics of pumping station. The
pump is always in stock and can be purchased
using Visa or MasterCard.
For more information, please e-mail
e-station@pfeiffer-vacuum.com.
Ulvac
Helium Leak Detector with Touch Screen
Operation
The Heliot 700 series helium leak detector
from ULVAC provides the sensitivity and
sophistication of a large, console-type
helium-testing unit in a small, compact package.
The Heliot 700 series features a multiple inlet
port design for the highest sensitivity–10-12 Torr-l/s. Troubleshooting is easily accomplished
with integrated maintenance software and a full
color touch-screen display can be customized by
the user for ease of operation. Other features
include start-up auto-calibration, optional
external leak calibration, and CE mark/IP30.
Heliot’s portability and automated features
allow for reliable super gross, gross, medium,
fine and superfine leak testing on large and
small objects, such as vacuum process chambers,
valves, pumps, heat exchangers, tanks, piping
and tubing assemblies, in any environment--including clean rooms. Heliot is ideal for use
in production and R&D applications in the
refrigeration, flat panel display, automotive,
aerospace, semiconductor and other manufacturing
industries.
Four helium leak detector models are
available in the Heliot 700 series–A totally
dry leak detector, the 701D1 is only $19,995 and
the 701D3 with 250 l/m scroll pump and cart is
$26,865. Standard units are available for
$18,000 with a small built-in rotary vane pump,
and $21,070 with a larger external rotary pump
and cart.
For more information, please contact ULVAC Technologies, Inc., Methuen, MA,
Web:
www.ulvac.com, Phone: 978-686-7550,
E-mail: sales@ulvac.com.
Kratos
Analytical: Booth 801
 Delay Line Detection
System Enhances Capability of AXIS Ultra XPS
Spectrometers:
The integration of the Micro-channel Plate (MCP)
based Delay Line Detector (DLD) into the Kratos
Analytical AXIS Ultra XPS spectrometer has
substantially increased the capability of the
instrument, opening up new application areas.
The detection system offers up to 128 channels
for parallel spectroscopic acquisitions
(snapshot mode), eliminating the need to scan
the hemispherical analyzer. This mode enables
fast depth profiling to be carried out as well
as enhances small spot performance and angle
resolved spectroscopy. The large number of data
channels ensures that no chemical information is
lost, a key aspect of XPS. The DLD also provides
substantial benefits for imaging applications.
The pulse counting system provides a direct
method for quantitative imaging via the high
speed, parallel acquisition system of the
Spherical Mirror Analyzer integrated into the
AXIS Ultra. These images enable spectroscopic
and quantitative information to be determined
from areas as small as 1.5µm. The high energy
resolution of the spherical mirror analyzer also
allows for direct and quantitative chemical
state distributions to be produced. These
features have enabled new application
capabilities in the fields of nano-technology
and biological materials. Visit
www.kratos.com.
Lambda:
Booth 500
 NEW
Highest Density Programmable Power 5kW in 2U
Lambda Americas Genesys™
Series of Programmable Power Supplies now has
the highest density with 5kW in 2U. Output 0 to
600VDC, 0-500A This makes the Gensys™ Series the
most complete set of platforms with identical
user interfaces across all rantes. Platforms
include 750W, 1500W, 3300W, 5000W and 10/15kW
Output. Also now available, an optional LXI
Certified LAN interface provides flexible system
integration and functionality for designers.
Standard features for all Genesys™ units include
reliable Front Panel encoders, built-in standard
RS-232/485, Last Setting Memory, User Selectable
Auto/Safe Re-start, External Analog Programming
and Monitoring 0-5V, 0-10V, optional IEEE or
Isolated Analog Programming and Monitoring. A
wide range of power factor corrected AC Input
options assures operation world wide. All units
carry Five (5) year Warranties. Lambda Americas
is ISO9001:2000 Certified.
For more information
click here
For more information on the benefits of
becoming an AVS Corporate Member, please contact
Angela Klink,
angela@avs.org,
212-248-0200 ext.221.
A&N Corporation
Advanced Energy Industries, Inc.
Alacatel Vacuum Products, Inc.
Altair Technologies, Inc.
American Scientific Publishers
AMETEK
Anatech, USA
Angstrom
Sciences
Applied
Surface Technologies
BellowsTech, LLC
Brushwellman, Inc. Electrofusion
Products
CeramTec
North America Corp.
Chuanbei Technology (Beijing) Co.,
Ltd.
Duniway
Stockroom Corp.
FMG
Enterprises, Inc.
G.P.R.
Company, Inc.
Gamma Vacuum
Innovative
Vacuum Solutions, Inc.
ION-TOF
USA, Inc.
Kratos
Analytical
Kurt
J. Lesker Company
Lamda Americas
MKS
Instruments Inc.
Nor-Cal Products, Inc.
Omicron
NanoTechnology USA
Pfeiffer Vacuum
Physical
Electronics
Process
Materials, Inc.
RF
VII, Inc.
RHK Technology, Inc.
Solid Sealing Technology, Inc.
SPECS
GmbH
Staib
Instruments, Inc.
Sumitomo (SHI) Cryogenics of
America, Inc.
Ted Pella, Inc.
Teledyne
Hastings Instruments
Thermal
Conductive Bonding, Inc.
Transfer Engineering and
Manufacturing, Inc.
Trelleborg
Sealing Solutions
Trinos
Vacuum Systems, Inc.
U-C
Components, Inc.
Vacuum
Research Ltd.
Varian,
Inc.
VAT,
Inc.
Veeco
Instruments, Inc.
Wiley-Blackwell
Zpulser
LLC
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 From Nano to
Astronomical:
The Science and Technology of
Materials, Interfaces, and Processing
Submit Online by May 14, 2008:
http://www2.avs.org/symposium/
AVS is currently
accepting abstract submissions for
presentation at the AVS 55th International
Symposium, October 19-24, 2008, in Boston,
MA. We encourage you to check out the
exciting sessions we have planned and submit
your abstract today.
Technical Symposia:
-
Advanced Surface Engineering
-
Applied Surface Science
-
Electronic Materials and Processing
-
Magnetic Interfaces and Nanostructures
-
MEMS and NEMS
-
Manufacturing Science and Technology
-
Nanometer-scale Science and Technology
-
Plasma Science and Technology
-
Surface Science
-
Thin Film
-
Vacuum Technology
Focused Topics:
Topical Conferences:
Special Sessions & Events:
Submit Online by May 14, 2008:
http://www2.avs.org/symposium/
Free Attedance!
The Exhibit comprises an extensive display
of tools, equipment, services and consulting
for film deposition, surface and interface
measurements and analysis, materials,
chemicals, supplies, vacuum production and
measurement, and related instrumentation for
surface, interface and film measurements, as
well as professional literature and
publications.
Each year, the technical
symposium expands into new and exciting
technical disciplines. Our Nanotechnology
division has grown to record levels and our
focus in emerging technologies, such as fuel
cell and energy research, consistently keeps
our Symposium fresh and exciting for
exhibitors and attendees alike.
Exhibit Hours:
-
Tues., October 21, 10:00 a.m.-6:30
p.m.
-
Wed., October 22, 10:00 a.m.-4:30
p.m.
-
Thurs., October 23, 10:30 a.m.-2:00
p.m.
The
exhibits will be open from Tuesday morning
until Thursday afternoon (October 21-23,
2008).
New and returning Exhibitors are
welcome. Please contact
exhibits@avs.org
for additional information or to make
recommendations for this year's AVS Exhibit.
You may also contact us at
212-248-0200, ext. 229.
A perennial strength of the AVS
International Symposium is an intensive
instructional program focused on topics
related to Vacuum and Equipment Technology,
Materials and Interface Characterization,
and Materials Processing. This year's
courses will include:
-
Atomic Layer
Deposition
-
Fundamentals of
Vacuum Technology
-
Partial Pressure
Analysis
-
Photovoltaics:
Engineering, Technology, and
Applications of Solar Cells
-
Plasma Etching and
RIE: Fundamentals & Applications
-
Reactive Sputter
Deposition
-
Sputter Depoistion
-
Surface Analysis,
Interfaces, & Thin Film Analysis: Major
Methods
-
Surface
Characterization of Biomaterials
-
UHV Design and
Practices
For complete course
descriptions and safe and secure
registration, please visit
http://www.avs.org/education.schedule.aspx
The AVS Professional Leadership and
Outreach Committee will be hosting the AVS
Career Center, open to all attendees, at the
International Symposium for the purpose of
connecting job seekers with potential
employers.
The goal is to facilitate contact and
networking during the Conference. In an
attempt to create more opportunities to
learn about potential employers there will
be a mini job fair during AVS 55.
To receive the maximum benefit from the
AVS Career Center please submit your resume
in advance (preferred) or at the beginning
of the week so we can have the binders ready
for employers to review and schedule
interviews!
Job Seekers:
-
Submit resume in
advance (preferred) or bring 6 Copies of
your resume (stapled and 3-hole punched)
-
Complete a time card
at beginning of the week at the Job
Center Registration area*
-
Attend Job Fair
-
Review job boards
daily
-
Leave messages for
employers/check back for replies
(frequently each day)
-
Be available for
onsite/informal interviews
-
Bring EXTRA, clean
copies of your resume to hand out as
needed
-
Your resume will be
included in binders available for review
by potential employers. When you leave a
message for an
-
employer of interest,
you are responsible to check back for a
reply message (i.e. interview/regrets,
etc.) It is important
-
to check in often
each day so you do not miss any
opportunities for an interview.
Advance Registration:
Please note that you may send in your resume
or job opening in advance, providing it
arrives on or before Friday, October 10,
2008. If you submit your resume in advance,
indicate if you will be in attendance at the
symposium. If you plan to attend the
symposium, please check in at the AVS Career
Center Registration area at the beginning of
the week so you don’t miss out on potential
interviews. Also you will need to complete a
time card and review the job boards.
Send Resumes to:
AVS Career Center, Attn: Heather Korff,
110 Yellowstone Dr., Ste. 120, Chico, CA
95973, Phone: 530-896-0477, Fax:
530-896-0487, E-mail:
heather@avs.org.
Employers:
To participate in the Career Services
center, please contact Heather Korff, Phone:
530-896-0477, Fax: 530-896-0487, E-mail:
heather@avs.org.
“The most beautiful thing we can
experience is the mysterious. It is the
source of all true art and science.”
Albert Einstein
Call for Science & Technology Artistic
Images—Submission Deadline: September
30, 2008
Often members of the AVS community use
scientific images to convey
information—sometimes these images contain
aesthetic qualities that evoke a personal,
intellectual, emotional, or spiritual
response transforming them into objects of
art. The question then is where does the
science end and the art begin? Let your
fellow colleagues be the judge or your
artistic interpretations of science as art.
Submission Guidelines and Rules:
Submissions should consist of images that
complement the “science & technology” topics
of the meeting. Images could be obtained by
any material imaging technique, modeling and
simulation, or by combining multiple images
into one artistic image.
The AVS Marketing Committee will select
the top 50 submissions for entry into the
contest at the Exhibition. While judging
will be based on the aesthetics of the image
rather than its scientific quality, it
should still relate back to the science &
technology of this meeting.
All images should be submitted by
September 30, 2008 as low resolution
jpeg/PDF files with a brief description of
the technique(s) used, the object(s) imaged,
and any other relevant comments. Please
e-mail them to Della Miller,
della@avs.org. Questions? Call
530-896-0477. Accepted images will need to
be brought to the conference in a designated
format; easels will be supplied for display.
Attendee Judging and Prizes
The top images, up to 50, will be
displayed at Equipment Exhibition from
Tuesday-Thursday. Attendees will have the
opportunity to vote for the best submission
throughout the week. Bring your friends!
First prize ($500), second prize ($250),
and third prize ($100) winners (based on
voting) will be announced at the Exhibit
Finale on Thursday in the Exhibit Hall.
These winning images may be used in future
AVS promotional pieces.
2007 Winners
First
Place ($500): "A
Nansized Silica Flower,"
Li-Chyong Chen, National Taiwan University
and Kuei-Hsien Chen, Academia Sinica
Second
Place ($250): "CuInSe_2
Bicrystal,"
Allen J. Hall, University of Illinois,
Urbana-Champaign
Third
Place ($100): "The
White Rose,"
Steven Hickman, Cornell University
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What's Inside
