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Symposium Chairs
C. Rebholz,
University of
Cyprus,
claus@ucy.ac.cy This topical symposium provides a forum to discuss surface and bulk engineering approaches to produce Nano-Energetic Materials and Structures for Nanomanufacturing. Thermal Nanomanufacturing, i.e. building multi-dimensional functional structures and devices by thermal processing of materials with nanoscale selectivity and control, aspires to afford the nanoworld with the flexibility and utility of established macroscale methods, such as rapid thermal processing, heat treatment, molding, welding, etc. This new and growing area critically hinges on the availability of miniature heat sources, with size and time response commensurate to nanoscale heat transfer phenomena and structure dimensions. Nanoscale heating sources (NanoHeaters), produced by methods such as sputtering, e-beam evaporation, chemical reduction, electrochemical deposition and mechanical alloying, have received great attention in recent years as enabling tools for nanofabrication/-manufacturing. The advantages for such type of heating sources include complete enthalpies release, versatile ignition methods (electrical, heat, etc.), conductive reaction product, and easy integration with other systems such as lab-on-a-chip. Potential applications include soldering, adhesive droplet, polymer memory devices, lab on a chip, hyperthermia for cancer treatment, etc. Topics of focus in this session include the formation of active micro-/nanostructures (thin films, particles, etc.) and their application in energetic systems. Contributions are solicited addressing both experimental and theoretical aspects of reaction kinetics.
Invited Speakers: Timothy P. Weihs, John Hopkins University, USA, weihs@jhu.edu, “Rapid Formation Reactions in Nanolayered Foils and Particles: Scientific Studies and Commercial Applications”
Edward
L. Dreizin,
New Jersey Institute of Technology, USA,
dreizin@njit.edu, "Fully-dense Reactive
Nanocomposite Powders and their Reaction Mechanisms.” . . . . . . . . . . . . . . . . . . . . . . . . . . .
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