Information
Clarkson University CAMP
Leila L. Boyea
Administrative Assistant
PO Box 5665
Potsdam, NY 13699-5665

Phone: 315-268-2336
Fax: 315-268-7615
E-mail:
leila@clarkson.edu


ICPT 2015 will be held at the Wild Horse Pass Hotel and Casino located in Chandler, Arizona from September 30-October 2, 2015.

ICPT 2015 is jointly hosted by CMP Userís Group of the Northern California Chapter of the American Vacuum Society and the Clarkson University Center for Advanced Materials Processing (CAMP). The conference will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP technology. ICPT 2015 promotes the exchange of opportunities, ideas, friendly relationships and research collaboration.

We look forward to seeing you at ICPT 2015 and welcoming you to the beautiful Wild Horse Pass Hotel and Casino in sunny Chandler, Arizona.

Plenary and Invited Speakers
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Keynote Speakers Organization Topic
Mark Dougherty Global Foundries Welcome to the 5th Dimension
Klaus Beyer IBM (retired) The Dynamics Of The CMP Discovery For Device Applications In IBM
Invited Speakers Organization Topic
Wei-Tsu Tseng (et al.) IBM Post Cleaning and Defect Reduction for Tungsten Chemical Mechanical Planarization
Dr. Shohei Shima Ebara Corporation Needs of In Situ Surface Analysis for Understanding and Improving CMP Processes
Lee Cook Dow Chemical Achieving Atomic Scale Control of CMP Planarization
Suresh Ramakrishnan Micron Challenges in CMP of Memory Devices
Catharina Rudolph (et al.) Fraunhofer Institute Challenges of TSV Backside Process Integration
Aniruddh Khanna Applied Materials Challenges and Opportunities for CMP in Yield Enhancement of sub-10nm nodes
Raghuveer R Patlolla IBM CMP Challenges and Process Development in Cu Interconnects with Advanced Barrier Materials
Michael Wedlake Samsung Electronics Replacement Metal Gate CMP Metrology Challenges with FINFET
Tae Hoon Lee Global Foundries CMP Challenges in Sub-14nm FinFET and RMG Technologies
Viorel Balan (et al.) CEA LETI CMP - 3D Enabler

Abstract Submission
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Abstract Submission Deadline : Extended to April 30, 2015

Abstract Submission Details & Template

Copyright © ICPT 2015

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